44432-2403

厂商：
MOLEX6
封装：
描述：
44432-2403 - 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Ver...

数据手册：

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44432-2403 数据手册

This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0444322403 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 24 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA TUV UL LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Literature Order No Product Name PCB Headers 44432 Board-to-Board, Wire-to-Board High Temperature|Square Pin|Offset Through Hole Mounting|Solder Type microfit_30 USA-106 Micro-Fit 3.0 BMI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Shrouded Stackable No 24 24 Black 30 94V-0 No Brass Gold Tin High Temperature Thermoplastic 2 Vertical 0.130 In 3.30 mm Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 30 0.75 100 2.5 Yes Fully No Search Parts in this Series 44432Series Mates With 44133 , 44764 , 44769 Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44432-001 PS-44300-001, RPS-44300-001 SD-44432-001 This document was generated on 05/24/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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44432-2403

1. 物料型号： - 型号：0444322403 - 状态：Active - 描述：3.00mm (.118") Pitch Micro-Fit 3.0 BMITM Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg. 24 Circuits, 0.76um (30") Gold (Au) Selective Plating

2. 器件简介： - 产品名称：Micro-Fit 3.0 BMITM - 系列：44432 - 应用：Board-to-Board, Wire-to-Board - 评论：High Temperature Square Pin Offset Through Hole

3. 引脚分配： - 电路数（已加载）：24 - 最大电路数：24

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大配对周期）：30 - 阻燃性：94V-0 - 材料 - 金属：黄铜 - 材料 - 镀层配对：金 - 材料 - 镀层终止：锡 - 材料 - 树脂：高温热塑性塑料 - 行数：2 - 定位：垂直 - PCB尾长（英寸）：0.130 In - PCB尾长（毫米）：3.30 mm - PCB定位器：是 - PCB保持：是 - 推荐PCB厚度（英寸）：0.062 In - 推荐PCB厚度（毫米）：1.60 mm - 包装类型：Tray - 配对界面间距（英寸）：0.118 In - 配对界面间距（毫米）：3.00 mm - 镀层最小：配对（uin）：30 - 镀层最小：配对（um）：0.75 - 镀层最小：终止（uin）：100 - 镀层最小：终止（um）：2.5 - 与PCB极化：是 - 屏蔽：完全 - 可堆叠：否

5. 功能详解： - 与44133、44764、44769型号相配 - 表面安装兼容（SMC） - 工作温度范围：-40°C至+105°C - 电气电流 - 每个接触最大：5A - 电压 - 最大：250V

6. 应用信息： - 应用：板对板、线对板

7. 封装信息： - 封装：完全屏蔽 - 堆叠：不可堆叠

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