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44769-0403

44769-0403

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    44769-0403 - 3.00mm (.118") Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Pre...

  • 详情介绍
  • 数据手册
  • 价格&库存
44769-0403 数据手册
This document was generated on 05/21/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0447690403 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0, BMI™ Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8µm (30µ") Gold (Au) Selective, 4 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL General Product Family Series Application Overview Product Literature Order No Product Name PCB Receptacles 44769 Board-to-Board, Wire-to-Board microfit_30 USA-106 Micro-Fit 3.0 BMI™ Physical Circuits (Loaded) Durability (mating cycles max) Flammability Glow-Wire Compliant Material - Metal Material - Plating Mating Material - Plating Termination Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 4 30 94V-0 No Phosphor Bronze Gold Tin 2 Vertical Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 30 0.75 100 2.5 Yes No -40°C to +105°C Through Hole Search Parts in this Series 44769Series Mates With 44428 , 44300 , 44432 Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature 5 Wave Capable (TH only) 1 Process Temperature max. C 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44769-001 PS-44300-001, RPS-44300-001 SD-44769-001 This document was generated on 05/21/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
44769-0403
1. 物料型号: - 型号:0447690403 - 状态:Active(活跃)

2. 器件简介: - 描述:3.00mm (.118") 间距 Micro-Fit 3.0, BMI™ 插座式端子排,双排,垂直安装,符合EU RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC未审核,非卤素自由。 - 具体型号:Press-fit Plastic Pegs, 0.8m (30) Gold (Au) Selective, 4 Circuits

3. 引脚分配: - 电路数(已加载):4 - 排数:2 - 方向:垂直 - PCB定位:是 - PCB保持:是

4. 参数特性: - 耐久性(最大配对周期):30 - 阻燃性:94V-0 - 金属材质:磷青铜 - 镀层配对:金 - 镀层终止:锡 - 配对界面间距:0.118英寸(3.00毫米) - 镀层最小厚度:配对30微英寸(0.75微米),终止100微英寸(2.5微米) - 极化到PCB:是 - 表面贴装兼容(SMC):否 - 工作温度范围:-40°C至+105°C

5. 功能详解: - 产品家族:PCB端子排 - 系列:44769 - 应用:板对板、线对板 - 产品名称:Micro-Fit 3.0 BMI™ - 物理特性:电路数为4,最大配对周期为30,阻燃等级为94V-0。

6. 应用信息: - 应用:板对板、线对板

7. 封装信息: - 封装类型:Tray(托盘) - 配对界面间距:0.118英寸(3.00毫米) - PCB厚度推荐:0.062英寸(1.60毫米)
44769-0403 价格&库存

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