44769-2203

44769-2203

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    44769-2203 - 3.00mm (.118") Pitch Micro-Fit 3.0, BMI™ Receptacle Header, Dual Row, Vertical, with Pr...

  • 详情介绍
  • 数据手册
  • 价格&库存
44769-2203 数据手册
This document was generated on 05/21/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0447692203 Active microfit_30 3.00mm (.118") Pitch Micro-Fit 3.0, BMI™ Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8µm (30µ") Gold (Au) Selective, 22 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-44300-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL General Product Family Series Application Overview Product Literature Order No Product Name PCB Receptacles 44769 Board-to-Board, Wire-to-Board microfit_30 USA-106 Micro-Fit 3.0 BMI™ Physical Circuits (Loaded) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 22 Black 30 94V-0 No Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical Yes Yes 0.062 In 1.60 mm Tray 0.118 In 3.00 mm 30 0.75 100 2.5 Yes No -40°C to +105°C Through Hole Search Parts in this Series 44769Series Mates With 44428 , 44300 , 44432 Electrical Current - Maximum per Contact Voltage - Maximum 5A 250V Solder Process Data Duration at Max. Process Temperature (seconds) 5 Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-44769-001 PS-44300-001, RPS-44300-001 SD-44769-001 This document was generated on 05/21/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
44769-2203
1. 物料型号 - 型号:0447692203 - 状态:Active(活跃)

2. 器件简介 - 描述:3.00mm(.118) Pitch Micro-Fit 3.0, BMITM Receptacle Header, Dual Press-fit Plastic Pegs, 0.8m (30") Gold (Au) Selective, 22 Circuit(3.00mm(.118)间距Micro-Fit 3.0, BMITM插座头,双压入式塑料定位销,0.8米(30英寸)金(Au)选择性镀层,22路)。

3. 引脚分配 - 电路(引脚):22个

4. 参数特性 - 色树脂:黑色 - 耐久性(最大插拔次数):30次 - 阻燃等级:94V-0 - 金属材质:磷青铜 - 镀层:接触部位金镀层,终止部位锡镀层 - 行数:2行 - 方向:垂直 - PCB定位:是 - PCB保持:是 - 推荐PCB厚度:0.062英寸(1.60毫米) - 接触界面间距:0.118英寸(3.00毫米) - 接触部位最小镀层厚度:30微英寸(0.75微米) - 终止部位最小镀层厚度:100微英寸(2.5微米) - 极化到PCB:是 - 表面贴装兼容(SMC):否 - 工作温度范围:-40°C至+105°C - 终止界面样式:通孔 - 最大电流每接触:5A - 最大电压:250V - 焊接过程数据:在最高工艺温度下持续时间5秒

5. 功能详解 - 产品系列:44769 - 应用:板对板、线对板 - 产品名称:Micro-Fit 3.0 BMITM - 物理特性:22路,黑色树脂,最大30次插拔,94V-0阻燃等级,磷青铜材质,金镀层接触部位,锡镀层终止部位

6. 应用信息 - 适用于板对板和线对板连接。

7. 封装信息 - 包装类型:Tray(托盘) - 接触界面间距:3.00mm(0.118英寸) - 推荐PCB厚度:1.60mm(0.062英寸)
44769-2203 价格&库存

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