### 物料型号
- Part Number: 0475937000
- Status: Active
- Description: Back Plate for Server Type 1.01mm, 040 Pitch LGA 1366 Processor Socket, Steel
### 器件简介
- Product Family: Processor Sockets
- Series: 47594
- Comments: Back Plate Assembly for Server Application
- Component Type: Back Plate Assembly
- Product Name: LGA1366
### 引脚分配
- Pitch - Mating Interface (in): 3.150 In
- Pitch - Mating Interface (mm): 80.00 mm
### 参数特性
- Circuits (Loaded): 0
- Durability (mating cycles max): 30
- Material - Metal: Steel
- Material - Plating Mating: Nickel
- Plating min: Mating (uin): 3.15
- Plating min: Mating (um): 80.00
- Temperature Range - Operating: -40°C to +88°C
- Termination Interface: Style: Screw or Lug
- Current - Maximum per Contact: 0.8A
- Voltage - Maximum: 5V
### 功能详解
- 该器件是一个用于服务器的背板组件,适用于LGA 1366处理器插座,具有30次的耐用插拔周期,金属材质为钢,镀层为镍,操作温度范围为-40°C至+88°C,每个接触点的最大电流为0.8A,最大电压为5V。
### 应用信息
- 适用于服务器应用的背板组件。
### 封装信息
- Packaging Type: Tray