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47593-8000

47593-8000

  • 厂商:

    MOLEX6

  • 封装:

  • 描述:

    47593-8000 - Back Plate for Desktop Type 1.01mm (.040") Pitch LGA 1366 Processor Socket, Steel - Mol...

  • 详情介绍
  • 数据手册
  • 价格&库存
47593-8000 数据手册
This document was generated on 04/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: Documents: 3D Model Drawing (PDF) 0475938000 Active Back Plate for Desktop Type 1.01mm (.040") Pitch LGA 1366 Processor Socket, Steel RoHS Certificate of Compliance (PDF) General Product Family Series Comments Component Type Product Name Processor Sockets 47594 Back Plate Assembly for Desktop Application Back Plate Assembly LGA1366 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Series Physical Circuits (Loaded) Circuits (maximum) Durability (mating cycles max) Material - Metal Material - Plating Mating Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Temperature Range - Operating Termination Interface: Style 0 0 30 Steel Nickel Tray 3.150 In 80.00 mm 3.15 80.00 -40°C to +88°C Screw or Lug Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Electrical Current - Maximum per Contact Voltage - Maximum 0.8A 5V Search Parts in this Series 47594Series Material Info Reference - Drawing Numbers Sales Drawing SD-47593-800 This document was generated on 04/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
47593-8000
物料型号: - 型号:0475938000 - 状态:Active(激活)

器件简介: - 产品家族:Processor Sockets(处理器插座) - 系列:47594 - 备注:Back Plate Assembly for Desktop Application(桌面应用的后板组件) - 组件类型:Back Plate Assembly(后板组件) - 产品名称:LGA1366

引脚分配: - 引脚间距:3.150英寸(80.00毫米)

参数特性: - 电路(已加载):0 - 电路(最大):未提供 - 耐用性(最大配对周期):30 - 金属材质:Steel(钢) - 配对接口镀层:Nickel(镍) - 包装类型:Tray(托盘) - 配对接口最小镀层厚度:3.15微英寸(80.00微米) - 工作温度范围:-40°C至+88°C - 终止接口样式:Screw or Lug(螺丝或栓)

功能详解: - 每个接触点最大电流:0.8A - 最大电压:5V

应用信息: - 用于桌面型1.01mm(.040)间距LGA 1366处理器插座的后板

封装信息: - 封装类型:Tray(托盘)
47593-8000 价格&库存

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