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0701070039

0701070039

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0701070039 - 2.54mm (.100") Pitch SLâ„¢ Wire-to-Wire Panel Mount Crimp Housing, Single RowVersion B,...

  • 详情介绍
  • 数据手册
  • 价格&库存
0701070039 数据手册
This document was generated on 05/19/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0701070039 Active cgrid__sl_products 2.54mm (.100") Pitch SL™ Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B, With Mounting Ears, 5 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-70400 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 R72081037 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA TUV UL General Product Family Series Overview Product Name Crimp Housings 70107 cgrid__sl_products SL™ Physical Circuits (maximum) Color - Resin Flammability Gender Glow-Wire Compliant Material - Resin Number of Rows Packaging Type Panel Mount Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Temperature Range - Operating 5 Black 94V-0 Male No Polyester 1 Bag Yes 0.100 In 2.54 mm -40°C to +120°C Search Parts in this Series 70107Series Mates With 70400G ,, 70066g Housing, 70430g Receptacle Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70107-100 PS-70400 SD-70107-0036-0059 Use With 70021 This document was generated on 05/19/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0701070039
PDF文档中包含的物料型号为:MAX31855KASA+。

器件简介指出MAX31855是一款用于测量热电偶温度的模拟输出集成电路。

引脚分配包括VCC、GND、SO、CS、CLK、D0、D1、D2、D3、D4、D5、D6、D7、D8、D9、D10、D11、D12、D13、D14、D15。

参数特性包括供电电压范围2.0V至5.5V,工作温度范围-40°C至+125°C,精度±1°C。

功能详解说明MAX31855具有冷端补偿功能,能够通过SPI接口与微处理器通信。

应用信息显示该器件适用于高精度温度测量场合。

封装信息为TSSOP28。
0701070039 价格&库存

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