0716617068

厂商：
MOLEX8
封装：
描述：
0716617068 - 1.27mm (.050") Pitch EBBIâ„¢ 50D Plug, Vertical, Blind Mate, 68 Circuits, 2.79mm(.110")...

数据手册：

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0716617068 数据手册

This document was generated on 06/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0716617068 Active ebbi_50d 1.27mm (.050") Pitch EBBI™ 50D Plug, Vertical, Blind Mate, 68 Circuits, 2.79mm (.110") PC Tail Length Documents: 3D Model Drawing (PDF) Product Specification PS-71660 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application MolexKits Overview Product Name PCB Headers 71661 Board-to-Board, Wire-to-Board Yes ebbi_50d EBBI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded No 68 68 Black 2,000 No 94V-0 No Yes None None Copper Alloy Gold Tin High Temperature Thermoplastic 2 Vertical 0.110 In 2.79 mm Yes Yes 0.062 In 1.60 mm Tray 0.050 In 1.27 mm 30 0.76 75 1.91 Yes Yes Fully Search Parts in this Series 71661Series Mates With EBBI™ 50D Receptacle 71660 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 1A 30V Solder Process Data Lead-free Process Capability Process Temperature max. C SMC & Wave Capable (TH only) 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-71660 PS-71660 SDA-71661-7*** This document was generated on 06/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0716617068

1. 物料型号： - 型号：0716617068 - 状态：Active（活跃）

2. 器件简介： - 描述：1.27mm (.050") 间距 EBBITM 50D 插头，垂直，盲配，68 Ci (.110") PC尾长。 - 文档：包含3D模型图纸（PDF）、产品规格PS-71660（RoHS合规证书）。

3. 引脚分配： - 电路（已加载）：68 - 最大电路数：68 - 引脚排列：2排

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大配对周期）：2,000次 - 阻燃等级：94V-0 - 镀层： - 配对界面最小镀金：30微英寸（0.76微米） - 镀层终止最小镀金：75微英寸（1.91微米）

5. 功能详解： - 产品家族：PCB头 - 系列：71661 - 应用：板对板、线对板 - MolexKits：是 - 物理特性：无断裂，无第一配对/最后断裂，有导向配合件，无键合配合件，无锁紧配合件 - PCB定位：是 - PCB保持：是 - 推荐PCB厚度：0.062英寸（1.60毫米） - 包装类型：托盘

6. 应用信息： - 与EBBI™ 50D插座71660兼容 - 工作温度范围：-40°C至+105°C - 电气特性： - 每个接触点最大电流：1A - 最大电压：30V - 焊接过程数据：无铅工艺能力，波峰焊和选择性波峰焊（仅TH）

7. 封装信息： - 完全封闭 - 封装材料：金属 - 铜合金，树脂 - 高温热塑性塑料 - 封装颜色：黑色

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