0736423100

0736423100

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736423100 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit,Open En...

  • 详情介绍
  • 数据手册
  • 价格&库存
0736423100 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736423100 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit, Open End, 144 Circuits Documents: Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification CSA UL LR19980 E29179 image - Reference only EU RoHS Not RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed China RoHS General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73642 Backplane Standard Press-Fit PCB Header hdm HDM® N/A Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 144 144 Black, Natural 250 No 94V-0 No None Phosphor Bronze Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 Search Parts in this Series 73642Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool HDM® Backplane 0622005703 Insertion Head for 144 Positions Extraction Tool 0621001000 Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Product Specification PS-73670-9999 Sales Drawing SDA-73642-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736423100
1. 物料型号: - 型号:0736423100 - 状态:Active(活跃)

2. 器件简介: - 产品名称:HDMR - 概述:2.00mm (.079") 间距 HDM® 板对板背板连接器,垂直式,Press-Fit(压接式),开放式末端,144路。

3. 引脚分配: - 列数:24 - 行数:6 - 配对数:开放式引脚场

4. 参数特性: - 电路(已加载):144 - 电路(最大):144 - 耐热性(最大插拔次数):250次 - 阻燃等级:94V-0 - 金属材质:磷青铜 - 接触镀层:金 - 终止镀层:锡 - 树脂材质:耐高温热塑性塑料

5. 功能详解: - 该连接器适用于背板应用,为标准Press-Fit类型,具有144个电路,垂直安装方式。

6. 应用信息: - 与73632 HDM PLUS® 板对板子卡插座和73780 HDM® 板对板子卡插座配合使用。

7. 封装信息: - 包装类型:管装 - 推荐PCB厚度:0.098英寸(2.50毫米) - 引脚间距:0.079英寸(2.00毫米) - 镀层最小厚度:接触镀金30微英寸(0.75微米),终止镀锡15微英寸(0.375微米)
0736423100 价格&库存

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