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0736433200

0736433200

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736433200 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit,Closed ...

  • 详情介绍
  • 数据手册
  • 价格&库存
0736433200 数据手册
This document was generated on 06/07/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736433200 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit, Closed End, 144 Circuits Documents: 3D Model Test Summary (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR18689 E29179 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73643 Backplane Standard Press-Fit PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 144 144 Black, Natural 250 No 94V-0 No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.062 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 Search Parts in this Series 73643Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool HDM® Backplane 0622005703 Insertion Head for 144 Positions Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Extraction Tool 0621001000 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Voltage - Maximum 1A 1.0 Gbps 75 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73643-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 06/07/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736433200
1. 物料型号: - 型号为:0736433200,属于73643系列。

2. 器件简介: - 器件为HDM封闭式端子,144个回路,用于背板应用,标准压接式PCB头。

3. 引脚分配: - 有24列和6行,形成144个回路(引脚)。

4. 参数特性: - 电路数(已加载):144,最大电路数:144。 - 颜色-树脂:黑色,自然色。 - 耐用性(最大配对周期数):250次。 - 材料-金属:磷青铜。 - 材料-镀层配对:金。 - 材料-镀层终止:锡-铅。 - 材料-树脂:耐高温热塑性塑料。

5. 功能详解应用信息: - 产品家族:背板连接器。 - 应用:背板。 - 配合型号:Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle。 - 电气数据:通过孔-合规插脚1A,最大每接触1.0 Gbps,75个实际信号(每25mm)。

6. 封装信息: - 封装类型:Tube。 - 配合界面间距:2.00 mm。 - 尾长(英寸):0.138 In,PCB厚度推荐(英寸):0.062 In。 - 封装最小镀层:配合界面0.75 um,终止界面0.375 um。
0736433200 价格&库存

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