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0736440000

0736440000

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736440000 - 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Gu...

  • 详情介绍
  • 数据手册
  • 价格&库存
0736440000 数据手册
This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736440000 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits Documents: 3D Model Test Summary (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 72 72 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Gold High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 2 0.05 Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/26/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736440000
1. 物料型号: - 型号:0736440000 - 状态:Active(活跃) - 环保合规性:符合欧盟RoHS、中国RoHS、ELV和RoHS,REACH SVHC不含SVHC,无卤素,未审核。

2. 器件简介: - 描述:2.00mm(.079")间距HDM板对板背板连接器,垂直安装,SMC适配,导向柱位置B,极化键位置A,72路电路。 - 产品家族:Backplane Connectors(背板连接器) - 系列:73644 - 应用:Backplane(背板) - 注释:Standard Press-Fit(标准压接) - 组件类型:PCB Header(PCB插座)

3. 引脚分配: - 电路(已加载):72 - 最大电路:72 - 列数:12 - 行数:6

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐久性(最大插拔次数):250 - 阻燃等级:94V-0 - 镀层 - 接触:金 - 镀层 - 终止:金 - 材料 - 金属:磷青铜,不锈钢 - 材料 - 树脂:耐高温热塑性塑料

5. 功能详解: - 导向至配对部件:是 - 与配对部件的键合:是 - 操作温度范围:-55°C至+105°C - 电气参数:最大每接触1A电流,1.0 Gbps数据速率,75个真实信号每25mm。

6. 应用信息: - 与73632 HDM PLUS®板对板子卡插座和73780 HDM®板对板子卡插座配合使用。

7. 封装信息: - 包装类型:Tube(管装) - 插孔尾长:0.138英寸(3.50毫米) - PCB厚度推荐:0.098英寸(2.50毫米) - 间距 - 配对接口:0.079英寸(2.00毫米) - 镀层最小值:接触区域30微英寸(0.75微米),终止区域2微英寸(0.05微米)
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