0736442109

0736442109

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736442109 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Gu...

  • 详情介绍
  • 数据手册
  • 价格&库存
0736442109 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736442109 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 72 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit, Tin/Lead (SnPb) PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 72 72 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 No Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736442109
1. 物料型号 - 型号:0736442109 - 状态:Active(活跃)

2. 器件简介 - 描述:2.00mm (.079") 间距 HDM 板对板背板连接器头,垂直安装,SMC 配合,导柱位置 A,极化键位置 E,72 路电路 - 产品家族:Backplane Connectors(背板连接器) - 系列:73644 - 应用:Backplane(背板) - 组件类型:PCB Header(PCB 连接器头)

3. 引脚分配 - 电路(已加载):72 - 电路(最大):72 - 列数:12 - 行数:6

4. 参数特性 - 颜色 - 树脂:黑色,自然色 - 耐久性(最大插拔次数):250 - 阻燃等级:94V-0 - 金属材质:镉青铜,不锈钢 - 镀层:金 - 镀层终止:锡 - 树脂材质:高温热塑性材料 - 引脚长度(英寸):0.138 In - 引脚长度(毫米):3.50 mm - PCB厚度推荐(英寸):0.098 In - PCB厚度推荐(毫米):2.50 mm - 间距 - 配合接口(英寸):0.079 In - 间距 - 配合接口(毫米):2.00 mm - 镀层最小:配合(微英寸):30 - 镀层最小:配合(微米):0.75 - 镀层最小:终止(微英寸):15 - 镀层最小:终止(微米):0.375

5. 功能详解 - 配合界面数据速率:1.0 Gbps - 实际信号(每25mm):75 - 屏蔽:否 - 电压 - 最大:250V AC

6. 应用信息 - 温度范围:-55°C 至 +105°C - 兼容的插针:通过孔 - 符合插针

7. 封装信息 - 封装类型:管装 - 包装规格:PK-70873-0818
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