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0736443016

0736443016

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736443016 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Gu...

  • 详情介绍
  • 数据手册
  • 价格&库存
0736443016 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736443016 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits Documents: 3D Model Test Summary (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit, Tin/Lead (SnPb) PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 144 144 Black, Natural 250 No 94V-0 Yes None Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool HDM® Backplane 0622005703 Insertion Head for 144 Positions Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Yes -55°C to +105°C Through Hole - Compliant Pin Extraction Tool 0621001000 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736443016
物料型号: - 型号:0736443016 - 状态:Active(活跃) - 中国RoHS:符合

器件简介: - 概述:2.00mm(0.079英寸)间距HDM板对板背板连接器,垂直式,共144个回路。 - 产品系列:73644 - 应用评论:背板 - 组件类型:PCB连接器

引脚分配: - 引脚数量:144个回路(已加载) - 最大回路数:144 - 列数:24 - 对数:开路接针场 - 行数:6

参数特性: - 颜色-树脂:黑色,自然色 - 耐用性(最大插拔次数):250次 - 阻燃性:94V-0 - 金属材质:磷青铜,不锈钢 - 镀层-接插:金 - 镀层-终止:锡 - 高温工程塑料 - PCB厚度推荐(英寸):0.098 - PCB厚度推荐(毫米):2.50mm - 间距-接插界面(英寸):0.079 - 间距-接插界面(毫米):2.00mm - 间距-终止界面(英寸):0.079 - 间距-终止界面(毫米):2.00mm - 镀层最小值:接插(微英寸)30;接插(微米)0.75;终止(微英寸)15;终止(微米)0.375

功能详解: - 配合型号:与73632 HDM PLUS®板对板女座和73780 HDM®板对板女座配合 - 电气参数:最大电流每接点1A,数据速率1.0Gbps,每25mm75个真实信号,最大电压250V AC

应用信息: - 应用:背板 - 温度范围:-55°C至+105°C - 通过孔-符合插针

封装信息: - 封装类型:管装 - 尾长PCB(英寸):0.138 - 尾长PCB(毫米):3.50mm
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