0736443203

厂商：
MOLEX8
封装：
描述：
0736443203 - 2.00mm (.079") Pitch HDMÂ® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Gu...

数据手册：

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0736443203 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736443203 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position B, 144 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit, Tin/Lead (SnPb) PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 144 144 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 No Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool HDM® Backplane 0622005703 Insertion Head for 144 Positions Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole - Compliant Pin Extraction Tool 0621001000 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0736443203

1. 物料型号： - 型号：0736443203 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC Fit, Guide Post Location A, Polarizing Key Position B, 144 Circuits（2.00毫米(.079英寸)间距HDM板对板背板连接器头，垂直安装，表面贴装兼容(SMC)，导向柱位置A，极化键位置B，144路） - 产品系列：73644 - 应用：Backplane（背板） - 组件类型：PCB Header（PCB连接器头）

3. 引脚分配： - 总路数：144路 - 列数：24列 - 行数：6行 - 垂直方向

4. 参数特性： - 颜色 - 树脂：黑色、自然色 - 耐久性（最大插拔次数）：250次 - 阻燃等级：94V-0 - 金属材质：镉青铜，不锈钢 - 镀层 - 接触：金 - 镀层 - 终止：高温热塑性锡 - 针脚长度（PC尾长）：0.138英寸（3.50毫米） - PCB厚度推荐：0.098英寸（2.50毫米） - 间距 - 接触界面（Pitch - Mating Interface）：0.079英寸（2.00毫米）

5. 功能详解： - 该连接器头适用于板对板背板应用，具有标准Press-Fit安装方式，镀锡/铅（SnPb）。 - 可与73632 HDM PLUS®板对板女儿卡插座和73780 HDM®板对板女儿卡插座配合使用。

6. 应用信息： - 工作温度范围：-55°C至+105°C - 最大每针脚电流：1A - 数据速率：1.0 Gbps - 实信号（每25mm）：75 - 屏蔽：无 - 电压 - 最大：250V AC

7. 封装信息： - 包装类型：管装 - 针脚长度（PC尾长）：0.138英寸（3.50毫米） - 推荐PCB厚度：0.098英寸（2.50毫米） - 间距 - 接触界面（Pitch - Mating Interface）：0.079英寸（2.00毫米）

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