0736443206

0736443206

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736443206 - 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Gu...

  • 详情介绍
  • 数据手册
  • 价格&库存
0736443206 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736443206 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit, Tin/Lead (SnPb) PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 144 144 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 No Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool HDM® Backplane 0622005703 Insertion Head for 144 Positions Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole - Compliant Pin Extraction Tool 0621001000 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736443206
物料型号: - 型号:0736443206 - 状态:Active(活跃) - 产品系列:73644

器件简介: - 描述:2.00mm (.079") 间距 HDM@ 板对板背板连接器头,垂直安装,SMC 配合,导向销位置 B,极化键位置 D,144 路 - 产品家族:背板连接器 - 应用:背板 - 组件类型:PCB 连接器头

引脚分配: - 电路(已加载):144 - 列数:24 - 行数:6 - 引脚间距:2.00mm

参数特性: - 颜色 - 树脂:黑色,自然色 - 耐用性(最大插配周期):250次 - 阻燃性:94V-0 - 金属材料:磷青铜,不锈钢 - 镀层 - 配合部位:金 - 镀层 - 终止部位:锡 - PC尾长:3.50mm - PCB厚度推荐:2.50mm - 包装类型:管装 - 配合界面间距:2.00mm

功能详解: - 该连接器为标准压配合用,锡/铅(SnPb)镀层 - 具有极化键和导向销,确保正确配对和插拔 - 适用于高密度的板对板连接

应用信息: - 与73632 HDM PLUS®板对板子卡插座和73780 HDM®板对板子卡插座配合使用

封装信息: - 封装类型:垂直安装 - 推荐PCB厚度:2.50mm - 封装材料:高温工程塑料 - 封装颜色:黑色
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