0736510033

厂商：
MOLEX8
封装：
描述：
0736510033 - 2.00mm (.079") Pitch HDM Board-to-Board Daughterboard Power Module, Right Angle, SMC, 3...

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0736510033 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736510033 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughterboard Power Module, Right Angle, SMC, 3-Blade Module, 3 Circuits Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73651 Daughtercard Power Receptacle hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 3 3 Black 250 No 94V-0 No None High Performance Alloy (HPA) Gold Tin High Temperature Thermoplastic 1 Open Pin Field 3 Right Angle 0.079 In 2.00 mm Yes None 0.062 In 1.60 mm Tube 0.157 In 4.00 mm 0.118 In 3.00 mm 30 0.75 100 2.5 No Search Parts in this Series 73651Series Mates With 73656 HDM® Board-to-Board Backplane Power Module Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A 1.0 Gbps 19 No 500V Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0820 Sales Drawing SDA-73651-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0736510033

1. 物料型号： - 型号：0736510033

2. 器件简介： - 描述：直角表面贴装3刀电源模块，3路电路，2.00mm（0.079英寸）间距HDM板对板女儿板电源。 - 产品家族：Backplane Connectors - 系列：73651 - 应用：Daughtercard - 组件类型：Power Receptacle

3. 引脚分配： - 电路（已加载）：3 - 电路（最大）：3 - 列数：开放式引脚场 - 行数：3

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：250 - 阻燃性：94V-0 - 金属材质：高性能合金（HPA） - 接触镀层：金 - 接触镀层终止：锡 - 树脂材质：高温热塑性塑料

5. 功能详解： - 该模块为HDM（高密度）板对板连接器，用于连接主板与女儿板，提供3路电路连接。

6. 应用信息： - 与73656 HDM®板对板背板电源模块配合使用，兼容堆叠表面贴装。

7. 封装信息： - 包装类型：管装 - 接口间距 - 配合界面（英寸）：0.157英寸 - 接口间距 - 配合界面（毫米）：4.00毫米 - 接口间距 - 终端界面（英寸）：0.118英寸 - 接口间距 - 终端界面（毫米）：3.00毫米 - 镀层最小值：配合界面（微英寸）：30，配合界面（微米）：0.75，终止界面（微英寸）：100，终止界面（微米）：2.5

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