0736560000

0736560000

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736560000 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMCPower Re...

  • 详情介绍
  • 数据手册
  • 价格&库存
0736560000 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736560000 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3 Circuits, Gold (Au) 0.76µm (30µ") Documents: 3D Model Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73656 Backplane Backplane Power Module Power Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 3 3 Black 250 No 94V-0 No None Beryllium Copper Gold Gold High Temperature Thermoplastic 1 Open Pin Field 3 Vertical Yes 0.098 In 2.50 mm Tube 0.138 In 3.50 mm 30 0.75 2 0.05 No Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 73656Series Mates With 73651 HDM® Board-to-Board Daughterboard Power Module Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0622005711 Power Module Loading Heads Electrical Current - Maximum per Contact Data Rate Voltage - Maximum 15A 1.0 Gbps 500V AC Material Info Reference - Drawing Numbers Application Specification AS-73656-1998 Packaging Specification PK-70873-0819 Product Specification PS-73670-9999 Sales Drawing SDA-73656-*00* HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736560000
1. 物料型号: - 型号:0736560000

2. 器件简介: - 描述:HDM®板对板背板电源模块,垂直,SMC(表面贴装兼容),电源插座,3路电路,金(Au)镀层0.76微米(30微英寸)。 - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC不含,无卤素。

3. 引脚分配: - 电路(已加载):3路 - 最大电路:3路 - 列数:1 - 行数:3 - 垂直方向

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250次 - 阻燃性:94V-0 - 金属材质:铍铜 - 镀层:接触部位金,终止部位金 - 树脂材质:高温热塑性塑料 - PCB厚度推荐:2.50毫米 - 接口间距:3.50毫米 - 镀层最小厚度:接触部位0.75微米,终止部位0.05微米 - 工作温度范围:-55°C至+105°C

5. 功能详解: - 产品系列:73656 - 应用:背板 - 组件类型:电源头 - HDM®系列,3路电源模块,垂直安装,兼容表面贴装。

6. 应用信息: - 与73651 HDM®板对板女板电源模块配合使用。

7. 封装信息: - 包装类型:管装 - 接口间距:2.00毫米(0.079英寸)
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