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0736560000

0736560000

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736560000 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMCPower Re...

  • 数据手册
  • 价格&库存
0736560000 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736560000 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3 Circuits, Gold (Au) 0.76µm (30µ") Documents: 3D Model Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73656 Backplane Backplane Power Module Power Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 3 3 Black 250 No 94V-0 No None Beryllium Copper Gold Gold High Temperature Thermoplastic 1 Open Pin Field 3 Vertical Yes 0.098 In 2.50 mm Tube 0.138 In 3.50 mm 30 0.75 2 0.05 No Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 73656Series Mates With 73651 HDM® Board-to-Board Daughterboard Power Module Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0622005711 Power Module Loading Heads Electrical Current - Maximum per Contact Data Rate Voltage - Maximum 15A 1.0 Gbps 500V AC Material Info Reference - Drawing Numbers Application Specification AS-73656-1998 Packaging Specification PK-70873-0819 Product Specification PS-73670-9999 Sales Drawing SDA-73656-*00* HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736560000 价格&库存

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