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0736560001

0736560001

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0736560001 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, SolderTail, ...

  • 详情介绍
  • 数据手册
  • 价格&库存
0736560001 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736560001 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73656 Backplane Midplane Power Module, Molex Series 73659 Power Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable 3 3 Black 250 No 94V-0 No None Beryllium Copper Gold Tin-Lead High Temperature Thermoplastic 1 Open Pin Field 3 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.000 In 0.00 mm 30 0.75 35.2 0.88 Yes No Search Parts in this Series 73656Series Mates With 73651 HDM® Board-to-Board Daughterboard Power Module Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Shielded Voltage - Maximum 15A 1.0 Gbps No 500V AC Material Info Reference - Drawing Numbers Application Specification AS-73656-1998 Packaging Specification PK-70873-0819 Product Specification PS-73670-9999 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0736560001
1. 物料型号: - 型号:0736560001 - 状态:符合欧盟RoHS和中国RoHS指令,不含SVHC物质,无卤素,状态为活跃。

2. 器件简介: - 产品系列:73656 - 应用:背板 - 组件类型:电源头 - 产品名称:HDMR - 概述:3电路的HDM电源插座

3. 引脚分配: - 电路(已加载):3 - 电路(最大):3 - 列数:1 - 行数:3 - 引脚排列:垂直

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250次 - 阻燃性:94V-0 - 金属材质:铍铜 - 镀层 - 插接:金 - 镀层 - 终止:锡铅 - 树脂材质:耐高温热塑性塑料 - PCB厚度推荐:2.50mm

5. 功能详解: - 极性化到PCB:是 - 可堆叠:否 - PCB定位:否 - PCB保持:是

6. 应用信息: - 与73651 HDM®板对板女儿板电源模块配合使用 - 工作温度范围:-55°C至+105°C - 最大电流每接触:15A - 数据速率:1.0 Gbps - 屏蔽:无

7. 封装信息: - 包装类型:管装 - 插接界面间距:0.00mm - 镀层最小:插接0.75um,终止0.88um
0736560001 价格&库存

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