0737800134

厂商：
MOLEX8
封装：
描述：
0737800134 - 2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Modul...

数据手册：

下载0737800134.pdf

立即购买

详情介绍
数据手册
价格&库存

0737800134 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737800134 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 14.00mm (.551"), Pin Length 2.50mm (.098"), Solder Tail Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Solder Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black 250 No No None Copper-Nickel-Tin Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.098 In 2.50 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Yes Yes -55°C to +105°C Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

下载 PDF

0737800134

1. 物料型号： - 型号：0737800134 - 产品名称：HDMR

2. 器件简介： - 产品家族：Backplane Connectors - 系列：73780 - 应用：Daughtercard, Mezzanine - 组件类型：PCB Receptacle - 概述：hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal

3. 引脚分配： - 电路（已加载）：72 - 列数：12 - 行数：6 - 引脚方向：垂直

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：250 - 材料 - 金属：铜镍锡合金 - 材料 - 镀层 - 接触：金 - 材料 - 镀层 - 终止：锡 - 材料 - 树脂：高温热塑性塑料 - PCB厚度推荐（mm）：1.60 mm - 间距 - 接触界面（mm）：2.00 mm - 镀层最小值：接触（um）0.75，终止（um）2.5

5. 功能详解： - 极性到PCB：否 - 可堆叠：是 - 表面安装兼容（SMC）：是 - 工作温度范围：-55°C至+105°C

6. 应用信息： - 与HDM® Board-to-Board Backplane Header 73642, 73643, 73644, 73942, 73943, 73944, 74349, 74428兼容。 - 与HDM® Board-to-Board Stacking Header 73769, 73770, 73782, 73783, 73771兼容。

7. 封装信息： - 包装类型：管装 - 引脚长度（mm）：2.50 mm

0737800134 价格&库存

-> 查询更多价格&库存

很抱歉，暂时无法提供与“0737800134”相匹配的价格&库存，您可以联系我们找货

免费人工找货

搜索历史

0737800134