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0737800153

0737800153

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0737800153 - 2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Modul...

  • 详情介绍
  • 数据手册
  • 价格&库存
0737800153 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737800153 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 2.50mm (.098"), Solder Tail Documents: 3D Model Drawing (PDF) Test Summary (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Solder Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) 72 72 Black 250 No No None Copper-Nickel-Tin Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Yes Yes Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Temperature Range - Operating Termination Interface: Style -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0737800153
物料型号: - Part Number: 0737800153

器件简介: - 该器件为一个72回路的模块,安装高度为13.00mm(0.512英寸),引脚长度为2.50mm(0.098英寸),尾端焊接。

引脚分配: - Circuits (Loaded): 72 - Circuits (maximum): 72 - Number of Columns: 12 - Number of Pairs: 30 - Number of Rows: 6

参数特性: - 间距: 2.00mm (0.079英寸) - 垂直安装 - 尾端焊接 - 耐热温度范围: -55°C至+105°C - 最大电流每接触点:15A(信号), 1A(电源) - 数据速率:1.0 Gbps - 屏蔽电压最大值:250V AC

功能详解: - 该器件与HDM®板对板背板头73642、73643、73644、73942、73943、73944、74349、74428以及HDM®板对板堆叠头73769、73770、73782、73783、73771兼容。

应用信息: - 产品符合欧盟RoHS、中国RoHS、ELV和RoHS标准。 - 不包含高度关注物质(SVHC),无卤素。

封装信息: - 封装类型:垂直安装 - PCB定位器:有 - PCB保持:有 - PCB厚度推荐(英寸):0.138 - PCB厚度推荐(mm):3.50 - 引脚间距(英寸):0.079 - 引脚间距(mm):2.00 - 尾端引脚长度(英寸):0.063 - 尾端引脚长度(mm):1.60
0737800153 价格&库存

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