0737800257

厂商：
MOLEX8
封装：
描述：
0737800257 - 2.00mm (.079") Pitch HDMÂ® Board-to-Board Daughtercard Receptacle, Vertical, SignalModu...

数据手册：

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0737800257 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737800257 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 17.00mm (.669"), Pin Length 3.50mm (.138"), Solder Tail Documents: 3D Model Drawing (PDF) Test Summary (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Solder Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) 72 72 Black 250 No No None Copper-Nickel-Tin Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Yes Yes Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Temperature Range - Operating Termination Interface: Style -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0872 Product Specification PS-73780-999 Sales Drawing SD-73780-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0737800257

1. 物料型号： - 型号：0737800257 - 状态：Active - 描述：2.00mm (.079") 间距 HDM® 板对板女儿卡插座，垂直，信号模块，72 路，安装高度 17.00mm (.669")，引脚长度 3.50mm (.138")，焊尾。

2. 器件简介： - 产品系列：Backplane Connectors 73780 Daughtercard, Mezzanine Solder Tail PCB Receptacle hdm HDM® - 符合性：符合EU RoHS、中国RoHS、ELV和RoHS标准。 - 无SVHC（高度关注物质）。

3. 引脚分配： - 电路（已加载）：72路 - 电路（最大）：250路 - 颜色：黑色 - 耐插拔次数（最大）：10000次 - 键位：无 - 金属材质：铜镍锡金。

4. 参数特性： - 温度范围：-55°C至+105°C - 电气参数：最大电流每接触点15A，1A 1.0 Gbps，75欧姆，250V交流电。 - 数据速率：实信号（每25mm）屏蔽。

5. 功能详解： - 焊接过程数据：最大处理温度下持续时间5秒，波峰焊接能力（仅限TH），无铅焊接能力最大周期260次，最大处理温度260°C。

6. 应用信息： - 适用于HDM®板对板背板插座73642、73643、73644、73942、73943、73944、74349、74428，以及HDM®板对板堆叠插座73769、73770、73782、73783、73771。

7. 封装信息： - 引脚间距：2.00mm（0.079"） - 引脚数量：12列开放引脚场 - 引脚方向：垂直 - PCB定位器：有 - PCB固定：有 - PCB厚度推荐：0.75mm（0.03"）

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