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0737802155

0737802155

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0737802155 - 2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Modul...

  • 详情介绍
  • 数据手册
  • 价格&库存
0737802155 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737802155 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 15.00mm (.591"), Pin Length 3.50mm (.138"), Press Fit Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black 250 No No None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No Yes Yes -55°C to +105°C Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0737802155
1. 物料型号: - 型号:0737802155 - 状态:Active(活跃)

2. 器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:73780 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座) - 概述:hdm 2.00mm (.079") 间距 HDM®板对板母卡插座,垂直安装,信号模块,72路,安装高度15.00mm (.591"),引脚长度3.50mm (.138"),压配合尾。

3. 引脚分配: - 列数:12 - 行数:6 - 引脚总数:72

4. 参数特性: - 电路数(已加载):72 - 最大电路数:72 - 树脂颜色:黑色 - 耐久性(最大插拔次数):250次 - 金属接点材料:铜镍锡合金 - 接点镀层:金 - 接点镀层终止:锡铅 - 树脂材料:耐高温热塑性塑料 - 推荐PCB厚度:1.60mm - 接点间距(配合接口):2.00mm - 接点镀层最小厚度(配合):0.75um - 接点镀层最小厚度(终止):0.88um

5. 功能详解: - 该连接器支持高达1.0 Gbps的数据传输速率,适用于屏蔽和非屏蔽信号,最大电压250V AC。

6. 应用信息: - 适用于子卡和夹层应用,具有压配合尾。

7. 封装信息: - 封装类型:Tube(管装) - 操作温度范围:-55°C至+105°C
0737802155 价格&库存

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