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0737802165

0737802165

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0737802165 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModu...

  • 详情介绍
  • 数据手册
  • 价格&库存
0737802165 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737802165 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 15.00mm (.591"), Pin Length 4.00mm (.157"), Press Fit Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS Not RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed China RoHS Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black 250 No No None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.157 In 4.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No Yes Yes -55°C to +105°C Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Solder Process Data Replacement RoHS Compliant Part Number None Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0737802165
物料型号: - Part Number: 0737802165 - 状态:Active(活动)

器件简介: - 产品名称:HDM® - 描述:HDM 2.00mm (.079") 间距 HDM® 板对板母卡插座,垂直,信号模块,72路,安装高度15.00mm (.591"),引脚长度4.00mm (.157"),压装式 - 产品系列:Series 73780 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座)

引脚分配: - 路数(Loaded)/最大路数:72/72 - 列数:12 - 行数:6

参数特性: - 颜色:Black(黑色) - 耐久性:最大250次插拔 - 材料:金属铜镍锡,镀金接触,镀锡铅终止 - 树脂材料:高温热塑性塑料 - 垂直方向 - PCB定位:无 - PCB保持:无 - 推荐PCB厚度:1.60mm - 包装类型:Tube(管装) - 接口间距:2.00mm - 接触镀层最小厚度:30µin(0.75µm), 35µin(0.88µm) - 极性:否 - 可堆叠:是 - 表面贴装兼容(SMC):是 - 工作温度范围:-55°C至+105°C

功能详解: - 配合HDM®板对板背板插座73642、73643、73644、73942、73943、73944、74349、74428。以及HDM®板对板堆叠插座73769、73770、73782、73783、73771使用 - 电气参数:最大电流每接触点15A,1A;数据速率1.0 Gbps;屏蔽电压最大75;非RoHS兼容替换件编号 - 环境合规性:EU RoHS、中国RoHS未RoHS兼容,REACH SVHC未审核,无卤素状态未审核

应用信息: - 通过孔兼容引脚

封装信息: - 引脚尾长:0.157英寸(4.00mm) - 接口间距:0.079英寸(2.00mm) - 终止接口间距:0.079英寸(2.00mm)
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