0737820100

厂商：
MOLEX8
封装：
描述：
0737820100 - 2.00mm (.079") Pitch HDMÂ® Board-to-Board Stacking Header, High Rise VerticalSMC, Close...

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0737820100 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737820100 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 72 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73782 Backplane, Mezzanine PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black 200 No 94V-0 No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.079 In 2.00 mm None 0.055 In 1.40 mm Tube 0.079 In 2.00 mm 30 0.75 100 2.5 No Yes Yes -55°C to +105°C Search Parts in this Series 73782Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Voltage - Maximum 1A 1.0 Gbps 72 100V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0870 Product Specification PS-73780-999 Sales Drawing SD-73782-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0737820100

1. 物料型号： - 型号：0737820100 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") 间距 HDM@ 板对板堆叠头，高密度，72路 - 产品家族：Backplane Connectors（背板连接器） - 系列：73782 - 应用：Backplane, Mezzanine（背板，夹层） - 组件类型：PCB Header（PCB 头）

3. 引脚分配： - 列数：12 - 行数：6 - 路数（已加载）：72 - 最大路数：72

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大配对周期）：200 - 阻燃性：94V-0 - 材料 - 金属：铍铜 - 材料 - 镀层配对：金 - 材料 - 镀层终止：锡-铅 - 材料 - 树脂：高温热塑性塑料 - 操作温度范围：-55°C 至 +105°C

5. 功能详解： - 该连接器支持高达1.0 Gbps的数据速率，并且每个接触点最大电流为1A，最大电压为100V AC。 - 焊接过程数据：无铅焊接，最大处理温度下持续时间为5秒，最多周期为260次。

6. 应用信息： - 与73632 HDM PLUS® 板对板daughtercard插座和73780 HDM® 板对板daughtercard插座兼容。

7. 封装信息： - 封装类型：管装 - 尾长（PCB）：2.00mm - 推荐PCB厚度：1.40mm - 间距 - 配对接口：2.00mm

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