0738002200

厂商：
MOLEX8
封装：
描述：
0738002200 - 2.00mm (.079") Pitch HDMÂ® Board-to-Board Midplane Header, Vertical, SMC, Press- Fit, L...

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0738002200 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0738002200 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Midplane Header, Vertical, SMC, PressFit, Long Pin, Open End Option, 72 Circuits Documents: Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73800 Midplane PCB Header hdm HDM® N/A image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black, Natural 250 No No None Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.453 In 11.50 mm No Yes 0.156 In 3.95 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35.2 0.88 No No Yes -55°C to +105°C Search Parts in this Series 73800Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press Electrical Current - Maximum per Contact 1A Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0868 Product Specification PS-73780-999 Sales Drawing SD-73800-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0738002200

1. 物料型号： - 型号：0738002200 - 状态：Active（活跃）

2. 器件简介： - 产品系列：Series 73800 - 应用：Midplane（中平面） - 组件类型：PCB Header（印刷电路板头） - 概述：2.00mm（.079"）Pitch HDM® Board-to-Board Midplane Header, Vertical, SMC, PressFit, Long Pin, Open End Option, 72 Circuits（2.00mm间距HDM®板对板中平面头，垂直，表面贴装兼容（SMC），压装，长针，开口端选项，72电路）

3. 引脚分配： - 列数：12 - 行数：6 - 电路（已加载）：72 - 最大电路数：72 - 开放引脚场：无

4. 参数特性： - 颜色 - 树脂：黑色，自然 - 耐用性（最大配对周期）：250 - 首次配对/最后断开：无 - 材料 - 镀层：配对金，终止锡铅 - 材料 - 树脂：高温热塑性塑料 - PCB尾长：0.453英寸（11.50毫米） - PCB厚度推荐：0.156英寸（3.95毫米） - 包装类型：管装 - 配对界面间距：0.079英寸（2.00毫米） - 镀层最小值：配对0.75微米，终止0.88微米

5. 功能详解： - 极化到PCB：否 - 可堆叠：否 - 表面贴装兼容（SMC）：是 - 工作温度范围：-55°C至+105°C - 每个接触的最大电流：1A

6. 应用信息： - 与73632 HDM PLUS® Board-to-Board Daughtercard Receptacle和73780 HDM® Board-to-Board Daughtercard Receptacle配合使用。

7. 封装信息： - 封装：每包PK-70873-0868 - 材料：外壳 - 液晶聚合物（LCP），玻璃填充，UL94V-0，颜色：黑色，终端 - 磷青铜 - 镀层：接触区域选择性冷镀（Au），最小厚度0.00076mm；镍（NT）和整体选择性金（Au）在接触区域。0.00076mm最小厚度：在合规区域选择性锡/铅（Sn/Pb）镍（Ni）整体。

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