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0738090217

0738090217

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0738090217 - 2.00mm (.079") Pitch HDM® Board-to-Board Midplane Header, Vertical, Press-Fit, Closed ...

  • 详情介绍
  • 数据手册
  • 价格&库存
0738090217 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0738090217 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Midplane Header, Vertical, Press-Fit, Closed End, Guide Post B Location, No Polarization Key, 72 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73809 Midplane Shroud Housing hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black 250 No 94V-0 No Yes Stainless Steel High Temperature Thermoplastic 12 Open Pin Field 6 Vertical None Tube 0.079 In 2.00 mm Yes Yes -55°C to +105°C Search Parts in this Series 73809Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Voltage - Maximum 1A 1.0 Gbps 72 250V AC Solder Process Data Lead-free Process Capability Process Temperature max. C Reflow Capable (SMT only) 260 Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SD-73809-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0738090217
物料型号: - 型号:0738090217 - 状态:Active(活跃)

器件简介: - 描述:2.00mm (.079") 间距 HDM® 板对板中平面垂直型压装式闭端无极性键无导向柱B位置72路电路的板对板中平面头 - 系列:73809 - 应用:Midplane(中平面) - 组件类型:Shroud Housing(屏蔽罩)

引脚分配: - 电路(已加载):72 - 最大电路:72 - 列数:12 - 对数(Open Pin Field):未明确 - 行数:6

参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):250 - 阻燃性:94V-0 - 材料 - 金属:不锈钢 - 材料 - 树脂:高温热塑性塑料 - PCB保持:无 - 包装类型:管装 - 接口间距(英寸):0.079 In - 接口间距(毫米):2.00 mm - 可堆叠:是 - 表面贴装兼容(SMC):是 - 工作温度范围:-55°C至+105°C - 电气特性: - 最大电流每接触点:1A - 数据速率:1.0 Gbps - 每25mm的实信号数:72 - 最大电压:250V AC - 焊接过程数据: - 无铅工艺能力:回流焊(仅限SMT)

功能详解: - 该产品符合Molex产品规格PS-73670-9999。 - 参考图纸SD-73800-001、SD-73801-001和SD-73802-001以获取尺寸信息。 - 产品标记有型号和日期代码,大约在所示位置的任一侧。

应用信息: - 与73632 HDM PLUS®板对板板卡插座和73780 HDM®板对板板卡插座配合使用。

封装信息: - 封装类型:管装 - 封装材料:液晶聚合物(LCP),玻璃填充,UL94V-0,颜色:黑色。
0738090217 价格&库存

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