0739426000

厂商：
MOLEX8
封装：
描述：
0739426000 - 2.00mm (.079") Pitch HDMÂ® Board-to-Board Backplane Header, Vertical, Solder TailOpen E...

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0739426000 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0739426000 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail, Open End, 72 Circuits Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification CSA UL LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73942 Backplane Solder Tail PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black, Natural 250 No 94V-0 No None Phosphor Bronze Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm None 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 30 0.75 100 2.5 Yes Yes -55°C to +105°C Search Parts in this Series 73942Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Data Rate Voltage - Maximum 1A 1.0 Gbps 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SD-73942-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0739426000

1. 物料型号： - 型号：0739426000 - 状态：Active（活跃） - 符合欧盟RoHS、中国RoHS、ELV和RoHS指令，REACH SVHC未审核，卤素含量状态未审核。

2. 器件简介： - 产品家族：Backplane Connectors（背板连接器） - 系列：73942 - 应用：Backplane（背板） - 组件类型：PCB Header（PCB插座） - 概述：Open End, 72 Circuits | 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical（开放式，72路 | 2.00mm (.079") 间距 HDM板对板背板插座，垂直）

3. 引脚分配： - 电路（已加载）：72 - 最大电路数：72 - 列数：12 - 行数：6 - 开放引脚场：是

4. 参数特性： - 颜色 - 树脂：黑色，自然色 - 耐用性（最大插拔次数）：250次 - 阻燃等级：94V-0 - 金属材质：磷青铜 - 接触镀层材质：金 - 终止镀层材质：锡 - 树脂材质：高温热塑性塑料 - 焊接尾长（英寸）：0.138 In - 焊接尾长（毫米）：3.50 mm - PCB厚度推荐（英寸）：0.098 In - PCB厚度推荐（毫米）：2.50 mm - 间距 - 接口（英寸）：0.079 In - 间距 - 接口（毫米）：2.00 mm - 镀层最小值：接触（微英寸）：30，接触（微米）：0.75，终止（微英寸）：100，终止（微米）：2.5

5. 功能详解： - 该连接器支持堆叠，兼容表面贴装（SMC），工作温度范围为-55°C至+105°C。

6. 应用信息： - 与73632 HDM PLUS®板对板插卡插座和73780 HDM®板对板插卡插座配合使用。

7. 封装信息： - 包装类型：管装 - 引脚间距：2.00mm

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