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0739427100

0739427100

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0739427100 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailOpen E...

  • 详情介绍
  • 数据手册
  • 价格&库存
0739427100 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0739427100 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail, Open End, 144 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73942 Backplane PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable 144 144 Black, Natural 250 No 94V-0 No None Phosphor Bronze Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No No Search Parts in this Series 73942Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SD-73942-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0739427100
1. 物料型号: - 型号:0739427100 - 状态:Active(活跃) - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC未审核,卤素含量状态未审核。

2. 器件简介: - 描述:2.00mm (.079") 间距 HDM@ 板对板背板连接器,垂直,焊接开口端,144路。 - 产品系列:Backlane Connecors 73942 - 应用:背板 - 组件类型:PCB 连接器 - 产品名称:HDMR

3. 引脚分配: - 电路数(已加载):144 - 电路数(最大):144 - 列数:24 - 行数:6 - 开放引脚场:无

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐用性(最大配对周期):250次 - 阻燃性:94V-0 - 镀层 - 配对最小厚度:0.75微米(30微英寸) - 镀层 - 终止最小厚度:2.5微米(100微英寸)

5. 功能详解: - 工作温度范围:-55°C至+105°C - 通孔 - 最大每接触电流:1A - 电气数据速率:1.0 Gbps - 屏蔽:否 - 电压 - 最大:250V AC

6. 应用信息: - 与73632 HDM PLUS® 板对板女儿卡插座和73780 HDM® 板对板女儿卡插座兼容。

7. 封装信息: - 推荐PCB厚度:0.098英寸(2.50毫米) - 包装类型:管装 - 配对界面间距:0.079英寸(2.00毫米) - 终止界面间距:0.079英寸(2.00毫米)
0739427100 价格&库存

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