0739446201

厂商：
MOLEX8
封装：
描述：
0739446201 - 2.00mm (.079") Pitch HDMÂ® Board-to-Board Backplane Header, Vertical, SMC, SolderTail, ...

数据手册：

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0739446201 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0739446201 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 72 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73944 Backplane PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 72 72 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm Yes None 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Search Parts in this Series 73944Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Shielded Voltage - Maximum 1A 1.0 Gbps No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Product Specification PS-73670-9999 Sales Drawing SD-73944-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0739446201

1. 物料型号： - 型号：0739446201 - 状态：Active（活跃） - 概述：2.00mm (.079") 间距 HDM® 板对板背板头，垂直，SMC，焊接

2. 器件简介： - 描述：2.00mm (.079) 间距 HDM® 板对板背板头，垂直尾，导引销选项，72电路 - 产品家族：背板连接器 - 系列：73944 - 应用：背板 - 组件类型：PCB头

3. 引脚分配： - 电路（已加载）：72 - 最大电路：72 - 列数：12 - 对数：开针场 - 行数：6

4. 参数特性： - 颜色 - 树脂：黑色，自然色 - 耐用性（最大插配周期）：250 - 阻燃性：94V-0 - 镀层最小值：插配（微英寸）30，插配（微米）0.75，终止（微英寸）100，终止（微米）2.5 - 间距 - 插配界面（英寸）：0.079，间距 - 插配界面（毫米）：2.00，间距 - 终止界面（英寸）：0.079，间距 - 终止界面（毫米）：2.00

5. 功能详解： - 该连接器支持高达1.0 Gbps的数据速率，并且每个接触点最大电流为1A，最大屏蔽电压为250V AC。

6. 应用信息： - 与73632 HDM PLUS® 板对板女儿卡插座和73780 HDM® 板对板女儿卡插座兼容。

7. 封装信息： - 包装类型：管装 - PCB厚度推荐（英寸）：0.098，PCB厚度推荐（毫米）：2.50 - 尾长（英寸）：0.138，尾长（毫米）：3.50

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0739446201