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0740298400

0740298400

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0740298400 - 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Receptacle Power Module,Vertical, ...

  • 详情介绍
  • 数据手册
  • 价格&库存
0740298400 数据手册
This document was generated on 05/19/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0740298400 Active vhdm 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Receptacle Power Module, Vertical, 8-Row, 2 Circuits, Pin 2 Voided, Gold (Au) Selective 0.76µm (30µ") Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-74031-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification UL E29179 General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74029 Backplane Tooling Manual Backplane Receptacle Module, Power Power Receptacle vhdm VHDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) 2 3 Pin 2 voided Black 200 No 94V-0 No None High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic N/A Open Pin Field 8 Vertical 0.110 In 2.80 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.157 In 4.00 mm 30 Search Parts in this Series 74029Series Mates With 74026 VHDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Backplane 0622020211 6 and 8 Row Power Module Insertion Tool Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.75 15 0.375 Yes No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 10A 2.5 Gbps 100 No 250V Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0876 Product Specification PS-74031-999 Sales Drawing SD-74029-002, SD-74029-009 VHDM and Very High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/19/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0740298400
物料型号: - 型号为74029系列。

器件简介: - 该产品为VHDM® Backplane 6和8排电源模块,垂直的,8排,2电路,第2个引脚是空的,选择性镀金(金)。

引脚分配: - 有8排,每排有2个电路,其中第2个引脚是空的。

参数特性: - 引脚间距:2.00mm(.079")。 - 接触镀层:最小镀层厚度,接触(微米):76µm(30µ")。 - 电气参数:最大每接触电气电流10A,数据速率:2.5 Gbps,操作温度范围:-55°C至+105°C,最大电压:250V。

功能详解: - VHDM® Backplane连接器提供了高性能的连接解决方案,支持高密度布线。

应用信息: - 该产品适用于电源模块,垂直连接,适用于高性能应用。

封装信息: - 封装类型:Pitch - Mating Interface(英寸)0.079,Pitch - Term. Interface(英寸)0.110。 - 引脚材料:金属,镀层材料:高耐热塑料,PCB定位:有,PCB保持:有。 - 包装类型:根据PK-70873-0876。
0740298400 价格&库存

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