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0740609006

0740609006

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0740609006 - 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row,Open Signa...

  • 详情介绍
  • 数据手册
  • 价格&库存
0740609006 数据手册
This document was generated on 05/19/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0740609006 Active vhdm 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield, Pin Length 4.75mm (.187") Documents: 3D Model Drawing (PDF) Product Specification PS-74031-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification UL General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74060 Backplane Tooling Manual Open Header PCB Header vhdm VHDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) 80 80 Black 200 No 94V-0 No None Beryllium Copper, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic N/A Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.039 In 1.00 mm 30 0.75 30 Search Parts in this Series 74060Series Mates With 74040 VHDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® 8 Row Pin 0622015900 and Shield Repair Tool Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 3A 3.125 Gbps 100 Ground Plane Shield Yes 120V AC (RMS)/DC VHDM® 8 Row 0622016100 Shield Extraction Tool VHDM® Insertion 0622020205 Module for Advanced Mate Signal Header, 8 Row by 10 Wide, 20.00mm (.787") VHDM® Insertion 0622020209 Module for Standard Shield Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Material Info Reference - Drawing Numbers Packaging Specification PK-74060-003 Product Specification PS-74031-999 Sales Drawing SD-74060-002 VHDM and Very High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/19/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0740609006
1. 物料型号: - 型号:0740609006

2. 器件简介: - 描述:2.00mm (.079") 间距的VHDM®板对板背板头,垂直,8路开口信号模块,80路电路,高级配对屏蔽,引脚长度4.75mm (.188")。

3. 引脚分配: - 电路数(已加载):80 - 电路数(最大):80 - 行数:8

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):200次 - 阻燃等级:94V-0 - 金属材质 - 镀层:铍铜,高性能合金(HPA) - 镀层 - 终止:锡铅 - 树脂材质:高温热塑性塑料 - 推荐PCB厚度:1.80mm

5. 功能详解: - 产品名称:VHDMR - 组件类型:PCB头 - 物理特性:开放式头 - 配对部分:无 - 屏蔽类型:屏蔽电压最大120V AC (RMS)/DC - 电气特性:最大每接触引脚电流3A,数据速率3.125Gbps,每25mm 100个真实信号

6. 应用信息: - 应用:背板 - 与74040 VHDM®板对板女儿卡插座配合使用

7. 封装信息: - 封装类型:管装 - 接口间距 - 配合界面:2.00mm - 接口间距 - 终端界面:1.00mm - 镀层最小:配合界面30µ",终止界面30µ"
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