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0740612522

0740612522

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0740612522 - 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header - Molex Electronics Ltd.

  • 详情介绍
  • 数据手册
  • 价格&库存
0740612522 数据手册
This document was generated on 06/01/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0740612522 Active vhdm 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 6.25mm (.246") Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74061 Backplane Tooling Manual Keying Position B PCB Header vhdm VHDM® N/A image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable 200 200 Black 200 No Yes Yes Beryllium Copper, High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic N/A Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 30 0.75 Yes No Search Parts in this Series 74061Series Mates With 74040 VHDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® 8 Row Pin 0622015900 and Shield Repair Tool VHDM® 8 Row 0622016100 Shield Extraction Tool Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes 105°C max Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 3.125 Gbps 100 Ground Plane Shield Yes 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Sales Drawing SD-74061-002 VHDM and Very High Density Metric are trademarks of Amphenol Corporation VHDM® Insertion 0622020206 Module for Advanced Mate Signal Header, 6 Row by 25 Wide, 50.00mm (1.97") VHDM® Insertion 0622020210 Module for Standard Shield Signal Header, 8 Row by 25 Wide, 50.00mm (1.97") Flat Rock Tooling for 0622013700 Pneumatic Press This document was generated on 06/01/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0740612522
物料型号: - 型号:0740612522 - 状态:Active(活跃) - 符合欧盟RoHS和中国RoHS豁免标准

器件简介: - 描述:2.00mm (.079") 间距 VHDM 板对板背板头,垂直,8行导向销信号模块,销端版本,200路,销长6.25mm (.246) - 产品家族:Backplane Connectors(背板连接器) - 系列:74061 - 应用:Backplane(背板) - 组件类型:PCB Header(PCB 头)

引脚分配: - 电路(已加载):200 - 最大电路:200 - 列数:不适用 - 对数:开路销场 - 行数:8 - 方向:垂直

参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大配对周期):200 - 第一次配对/最后断开:否 - 导向配合部件:是 - 配合部件的键控:是 - 材料 - 金属:铍铜,高性能合金(HPA),不锈钢 - 材料 - 镀层配合:金 - 材料 - 镀层终止:锡铅 - 材料 - 树脂:高温热塑性塑料 - PCB 尾长(英寸):0.098 - PCB 尾长(毫米):2.50 mm - PCB定位器:无 - PCB保持:无 - 推荐PCB厚度(英寸):0.070 In - 推荐PCB厚度(毫米):1.80 mm - 包装类型:管装 - 配合界面间距(英寸):0.079 In - 配合界面间距(毫米):2.00 mm - 终止界面间距(英寸):0.079In - 终止界面间距(毫米):2.00 mm - 镀层最小:配合(微英寸):30 - 镀层最小:配合(微米):0.75 - 镀层最小:终止(微英寸):30 - 镀层最小:终止(微米):0.75 - 极化到PCB:是 - 可堆叠:否

功能详解应用信息: - 与74040 VHDM® 板对板女儿卡插座配合使用 - 操作温度范围:最高105°C - 电气:每接触最大电流1A,数据速率3.125 Gbps,25mm内100个真实信号,屏蔽类型为屏蔽,电压最大120V AC (RMS)/DC

封装信息: - 封装:垂直 - 间距 - 配合界面(英寸):0.079 In - 间距 - 配合界面(毫米):2.00 mm - 间距 - 终止界面(英寸):0.079In - 间距 - 终止界面(毫米):2.00 mm
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