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0740628502

0740628502

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0740628502 - 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin S...

  • 详情介绍
  • 数据手册
  • 价格&库存
0740628502 数据手册
This document was generated on 05/19/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0740628502 Active vhdm 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Shield End Version, Lead Free, Pin End Version, 200 Circuits, Pin Length 5.15mm (.203") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74062 Backplane Tooling Manual No Keying Position PCB Header vhdm VHDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) 200 200 Black 200 No 94V-0 Yes None Beryllium Copper, High Performance Alloy (HPA), Stainless Steel Gold Tin High Temperature Thermoplastic N/A Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 Search Parts in this Series 74062Series Mates With 74040 VHDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® 8 Row Pin 0622015900 and Shield Repair Tool Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 30 0.75 Yes No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 3.125 Gbps 100 Ground Plane Shield Yes 120V AC (RMS)/DC VHDM® 8 Row 0622016100 Shield Extraction Tool VHDM® Insertion 0622020206 Module for Advanced Mate Signal Header, 6 Row by 25 Wide, 50.00mm (1.97") VHDM® Insertion 0622020210 Module for Standard Shield Signal Header, 8 Row by 25 Wide, 50.00mm (1.97") Material Info Reference - Drawing Numbers Sales Drawing SD-74062-002 VHDM and Very High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/19/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0740628502
物料型号: - 型号:0740628502 - 状态:Active(激活)

器件简介: - 描述:vhdm 2.00mm (.079") 间距 VHDM® 板对板背板连接器头,垂直式,8排,vhdm 引导销信号模块,屏蔽端版本,无铅,针端版本,200路,针长5.15mm (.203")。

引脚分配: - 电路(已加载):200 - 最大电路:200 - 列数:不适用 - 对数:开放引脚场 - 行数:8

参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大配对周期):200 - 首次配对/最后断开:否 - 阻燃性:94V-0 - 引导至配对部件:是 - 配对部件的键控:无 - 金属材质:铍铜,高性能合金(HPA)。不锈钢 - 配对金属材质 - 镀层:金 - 终止金属材质 - 镀层:锡 - 树脂材质:高温热塑性塑料

功能详解: - 产品家族:背板连接器 - 系列:74062 - 应用:背板 - 配对使用:74040 VHDM® 板对板母卡插座

应用信息: - 操作温度范围:-55°C至+105°C - 电气电流 - 每个接触最大:1A - 数据速率实际信号(每25mm):3.125 Gbps - 屏蔽类型:屏蔽 - 电压 - 最大:120V AC(RMS)/DC

封装信息: - 外壳:液晶聚合物 LCP - 信号针 & 屏蔽:铜合金 - 封装类型:管装 - 推荐PCB厚度(英寸):0.070 In - 推荐PCB厚度(毫米):1.80 mm - 配对界面间距(英寸):0.079 In - 配对界面间距(毫米):2.00 mm - 终止接口间距(英寸):0.079 In - 终止接口间距(毫米):2.00 mm - 镀层最小:配对(微英寸):30 - 镀层最小:配对(微米):0.75
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