0743000143

0743000143

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0743000143 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModu...

  • 详情介绍
  • 数据手册
  • 价格&库存
0743000143 数据手册
This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743000143 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 3.00mm (.118"), Lead-Free Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74300 Daughtercard, Mezzanine PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 72 72 Black 250 No Yes None Copper-Nickel-Tin Gold Matte Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 100 2.50 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74300Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 74349 , 74428 , 73769 , 73781 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 76 Yes 250V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 40 SMC & Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-74300-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0743000143
1. 物料型号: - 型号:0743000143 - 状态:Active(活跃)

2. 器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:74300 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座) - 概述:hdm - 产品名称:HDMR

3. 引脚分配: - 电路(已加载):72 - 电路(最大):72 - 列数:24 - 行数:6 - 引脚方向:Vertical(垂直)

4. 参数特性: - 颜色 - 树脂:Black(黑色) - 耐用性(最大插拔次数):250 - 首次配对/最后断裂:No(否) - 导向配合部件:Yes(是) - 键控配合部件:None(无) - 金属材质:Copper-Nickel-Tin(铜-镍-锡) - 配合界面镀层:Gold(金) - 终止镀层:Matte Tin(亚光锡) - 树脂材质:High Temperature Thermoplastic(高温热塑性塑料) - PC尾长:3.00 mm / 0.118 In - PCB厚度推荐:1.60 mm / 0.063 In - 配合界面间距:2.00 mm / 0.079 In - 镀层最小厚度 - 配合:0.76 um / 30 uin - 镀层最小厚度 - 终止:2.50 um / 100 uin - 极性到PCB:No(否) - 可堆叠:Yes(是) - 表面安装兼容(SMC):Yes(是) - 工作温度范围:-55°C至+105°C - 终止界面样式:Through Hole - Compliant Pin(通孔 - 合规引脚)

5. 功能详解: - 该连接器为HDM®板对板女儿卡插座,具有72个电路,垂直安装,带有导向,安装高度为13.00mm,引脚长度为3.00mm,无铅。

6. 应用信息: - 适用于子卡和夹层应用,与HDM®板对板背板头配对使用。

7. 封装信息: - 封装类型:Tube(管装)
0743000143 价格&库存

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