0743008143

0743008143

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0743008143 - 2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Modul...

  • 详情介绍
  • 数据手册
  • 价格&库存
0743008143 数据手册
This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743008143 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 13.00mm (.512"), Press-Fit Pin Length 3.00mm (.118"), Lead-Free Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74300 Daughtercard, Mezzanine PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 144 144 Black 250 No Yes None Copper-Nickel-Tin Gold Gold High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 30 .88 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74300Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 74349 , 74428 , 73769 , 73781 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 76 Yes 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-74300-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0743008143
1. 物料型号: - 型号:0743008143 - 描述:Activehdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 13.00mm (.512"), Press-Fit Pin Length 3.00mm (.118"), Lead-Free

2. 器件简介: - 产品系列:HDM® - 应用:Board-to-Board Daughtercard Receptacle - 特点:垂直信号模块,带导向,144电路,安装高度13.00mm,压接针长度3.00mm,无铅

3. 引脚分配: - 电路数:144 - 列数:24 - 对数:6 - 行数:垂直6行

4. 参数特性: - 物理电路(已加载):144 - 最大电路数:250 - 颜色:黑色 - 耐用性(最大插拔次数):250次 - 导向:至匹配部件 - 金属材质:铜-镍-锡 - 电镀:金 - 电镀厚度:接触区域金至少76微米,选择性锡(Sn)在焊尾上至少0.88微米,压接尾上至少0.15微米,镍(ND)整体覆盖

5. 功能详解: - 最大电流每接触:1A - 数据速率:1.0 Gbps - 屏蔽:是 - 电压最大值:未提供具体数值 - 参考图纸编号:PS-73780-999

6. 应用信息: - 工作温度范围:-55°C至+105°C - 兼容性:兼容HDM® Board-to-Board Backplane Header,如73642, 73643, 73644等型号

7. 封装信息: - 封装类型:通孔 - 兼容性(SMC):是 - 封装材料:housing - 液晶聚合物(LCP)玻璃填充,94V-0,颜色:黑色;terminals - 铜合金 - 封装厚度推荐:0.76 in (19.58 mm)
0743008143 价格&库存

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