0746491002

0746491002

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0746491002 - 2.00mm (.079") Pitch 8-Row VHDM-HSDâ„¢ Backplane Header, Open Module, 80Circuits, Pin L...

  • 详情介绍
  • 数据手册
  • 价格&库存
0746491002 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746491002 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Open Module, 80 Circuits, Pin Length 6.25mm (.246") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74649 Backplane Tooling Manual Open Header PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) 80 80 Black 200 No 94V-0 No None Copper-Nickel-Silicon, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 10 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 30 Search Parts in this Series 74649Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Insertion 0622020205 Module for Advanced Mate Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 5.0 Gbps 72 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74060-003 SD-74649-002 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0746491002
1. 物料型号: - 型号:0746491002 - 系列:74649 - 符合欧盟RoHS和中国RoHS指令,豁免情况下符合REACH指令,不含SVHC(高度关注物质),无卤素,无卤素状态。

2. 器件简介: - 产品名称:VHDM-HSD™ - 概述:vhdm hsd,2.00mm(.079")间距,8行VHDM-HSD™背板头,开放式模块,80个电路,引脚长度6.25mm(.246")。

3. 引脚分配: - 列数:10 - 行数:8 - 开放引脚场:是 - PCB厚度推荐:0.070英寸(1.80mm)

4. 参数特性: - 电路(已加载):80 - 电路(最大):80 - 树脂颜色:黑色 - 耐久性(最大插拔次数):200次 - 首次配对/最后断开阻燃性:无 - 94V-0阻燃等级 - 金属材质:铜镍-硅,高性能合金(HPA) - 镀层:金 - 镀层终止:锡-铅 - 树脂材质:高温热塑性塑料

5. 功能详解: - VHDM-HSD™是一种高性能的背板连接器,适用于需要高密度和高速度数据传输的应用。它支持高达5.0Gbps的数据速率,并且具有屏蔽电压最大值72V的特性。

6. 应用信息: - 适用于背板应用,与HSD母卡74680、74686配合使用,与女儿卡模块一起使用。

7. 封装信息: - 包装类型:管装 - 接口间距(接口):2.00mm(0.079英寸) - 接口间距(终止):2.00mm(0.079英寸) - 镀层最小值:配合(微英寸)30,配合(微米)0.75,终止(微英寸)30
0746491002 价格&库存

很抱歉,暂时无法提供与“0746491002”相匹配的价格&库存,您可以联系我们找货

免费人工找货