0746491003

0746491003

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0746491003 - 2.00mm (.079") Pitch 8-Row VHDM-HSD Backplane Header, Open Module, 80 Circuits, Pin Len...

  • 详情介绍
  • 数据手册
  • 价格&库存
0746491003 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746491003 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Open Module, 80 Circuits, Pin Length 4.25mm (.167") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74649 Backplane Tooling Manual Open Header PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) 80 80 Black 200 No 94V-0 No None Copper-Nickel-Silicon, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 10 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 30 Search Parts in this Series 74649Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Insertion 0622020205 Module for Advanced Mate Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 5.0 Gbps 72 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74060-003 SD-74649-002 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0746491003
1. 物料型号: - 型号:0746491003 - 系列:74649 - 状态:Active(活跃)

2. 器件简介: - 描述:2.00mm (.079") 间距,8行VHDM-HSD™背板插座,开放模块,80路电路,引脚长度4.25mm (.167")。 - 产品名称:VHDM-HSD™。

3. 引脚分配: - 引脚数量:每行10个引脚,共8行,总计80个引脚。 - 引脚间距:2.00mm (.079")。

4. 参数特性: - 电路数(已加载):80 - 电路数(最大):80 - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):200次 - 材料 - 金属:铜镍硅合金(HPA) - 材料 - 镀层:金镀层 - 材料 - 树脂:高温热塑性塑料 - 列数:10 - 行数:8 - 垂直方向:垂直 - PCB厚度推荐:0.070英寸(1.80毫米) - 引脚间距 - 接口:2.00mm (.079")。

5. 功能详解: - VHDM-HSD™是Amphenol Corporation的商标,是一种高速数据传输的背板连接器。 - 应用:背板。 - 配合使用的产品:HSD女儿卡74680、74686。 - 电气特性:最大每接触引脚电流1A,数据速率5.0Gbps,屏蔽类型为地平面屏蔽,最大电压250V。

6. 应用信息: - 应用工具文档:提供了工具手册的链接,用于安装和使用该产品。 - 应用温度范围:-55°C至+105°C。

7. 封装信息: - 封装类型:管装。 - 引脚镀层最小厚度:金镀层0.75µm,锡铅镀层1.27µm。
0746491003 价格&库存

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