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0746501001

0746501001

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    0746501001 - 2.00mm (.079") Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Pin End ...

  • 详情介绍
  • 数据手册
  • 价格&库存
0746501001 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746501001 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Pin End Version, 60 Circuits, Pin Length 4.75mm (.187") Documents: Drawing (PDF) Product Specification PS-74031-999 (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification CSA UL LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74650 Backplane Tooling Manual No Keying Position PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) 60 60 Black 200 No 94V-0 Yes None Copper-Nickel-Silicon, High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic 10 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 Search Parts in this Series 74650Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® Insertion 0622020205 Module for Advanced Mate Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.75 30 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 5.0 Gbps 72 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74061-003 PS-74031-999 SD-74650-002 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0746501001
1. 物料型号: - 型号:0746501001 Activevhdm__hsd - 描述:2.00mm (.079") 间距 8-行 VHDM-HSD™ 背板插座,导向销信号模块,销端版本,60路,销长4.75mm (.187")。

2. 器件简介: - 产品系列:74650系列 - 应用:背板连接器 - 特点:VHDM-HSD™,无卤素,符合RoHS指令,REACH SVHC合规。

3. 引脚分配: - 电路数:60 - 列数:8 - 行数:10 - 引脚方向:垂直 - 开放引脚场:10 - PCB定位器:有 - PCB保持:有

4. 参数特性: - 颜色:黑色 - 耐久性:最大200次配对 - 阻燃等级:94V-0 - 配合母板:HSD女儿卡74680、74686 - 最大电压:250V - 最大电流每接触点:1A - 数据速率:5.0 Gbps - 屏蔽类型:地平面屏蔽

5. 功能详解: - VHDM®信号销:0622015700 - 插入器修理工具:VHDM®插入模块,用于高级母信号头,8行10宽,20.00mm (.787"):0622020205 - 极化到PCB:是 - 堆叠:是 - 表面安装兼容(SMC):是 - 工作温度范围:-55°C至+105°C - 电气接口:通孔 - 合规销

6. 应用信息: - 与HSD女儿卡配合使用 - 应用工具和FAQ:通过选择下面提到的产品找到工具规格和手册,压接高度规格包含在应用工具规格文件中。

7. 封装信息: - 引脚间距:2.50mm - 引脚尾长(英寸):0.098 In - 引脚尾长(毫米):2.50 mm - 推荐PCB厚度(英寸):0.070 In - 推荐PCB厚度(毫米):1.80 mm - 包装类型:管装 - 配合接口间距(英寸):0.079 In - 配合接口间距(毫米):2.00 mm - 终止接口间距(英寸):0.079 In - 终止接口间距(毫米):2.00 mm - 镀层最小厚度(配合):0.75 µin - 镀层最小厚度(终止):0.75 µm
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