0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
70246-3002

70246-3002

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    70246-3002 - 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circu...

  • 详情介绍
  • 数据手册
  • 价格&库存
70246-3002 数据手册
This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0702463002 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification CSA UL LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Overview Product Name PCB Headers 70246 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Plating Mating Material - Plating Termination Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating No 30 30 No 94V-0 No No None None Gold Tin 2 Vertical 0.135 In 3.43 mm No None 0.062 In 1.60 mm Tray 0.100 In 2.54 mm 0.100 In 2.54 mm 30 0.75 75.2 1.88 Center Slot No Fully No No -55°C to +120°C Search Parts in this Series 70246Series Mates With 70450 SL™ Crimp Housing, 70058 SL™ Crimp Terminal Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 Wave Capable (TH only) 1 265 Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing PK-87835-001 SDA-70246-**20-25,39 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
70246-3002
1. 物料型号: - 型号:0702463002 - 状态:Active(活跃)

2. 器件简介: - 描述:2.54mm(.100")Pitch C-Grid® Header,低轮廓,双排,垂直,带护罩,30路。 - 产品系列:70246 - 应用:Wire-to-Board(线对板)

3. 引脚分配: - 引脚数量(已加载):30 - 最大引脚数量:30

4. 参数特性: - 接触材料:金(Au)选择性电镀,锡(Sn)PC尾电镀。 - 阻燃等级:94V-0 - 工作温度范围:-55°C至+120°C - 电路(满载):30 - 电路(最大):30

5. 功能详解: - 该连接器为C-Grid®系列,具有30个接触点,适用于线对板应用。 - 接触材料为金和锡,以确保良好的电气连接和耐腐蚀性。 - 工作温度范围广泛,适用于多种环境条件。

6. 应用信息: - 与70450 SL™ Crimp Housing和70058 SL™ Crimp Terminal配合使用。 - 通过孔方式。

7. 封装信息: - 封装类型:Tray(托盘) - 引脚间距:2.54mm - PCB推荐厚度:0.062英寸(1.60mm)
70246-3002 价格&库存

很抱歉,暂时无法提供与“70246-3002”相匹配的价格&库存,您可以联系我们找货

免费人工找货