70553-0106

70553-0106

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    70553-0106 - 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" PocketShro...

  • 详情介绍
  • 数据手册
  • 价格&库存
70553-0106 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0705530106 Active cgrid__sl_products 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" Pocket, Shrouded, 2 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Series Product Specification PS-70400 (PDF) Product Specification PS-70541 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70553 Wire-to-Board cgrid__sl_products SL™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Guide to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Shrouded Stackable Temperature Range - Operating No 2 2 Black 50 94V-0 No Yes Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 1 Right Angle 0.130 In 3.30 mm No None 0.062 In 1.60 mm Tube 0.100 In 2.54 mm 30 0.75 75 1.875 Yes Fully No -40°C to +105°C Search Parts in this Series 70553Series Mates With 70066n , 70066g , 70430g , 70400g Housing Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 3A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 3 Wave Capable (TH only) 1 260 Material Info Old Part Number A-70553-0106 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0015 PS-70400, PS-70541 SDA-70553-**** This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
70553-0106
### 物料型号 - 型号:0705530106 - 状态:Active(活跃) - 描述:Shrouded, 2 Circuits, 0.76um(30")Gold (Au) Selective Plating, Tin (Sn) PC Tail(带护罩,2回路,0.76微米(30英寸)金(Au)选择性镀层,锡(Sn)PC尾)

### 器件简介 - 系列:70553 - 应用:Wire-to-Board(线对板) - 产品名称:SLTM - 物理特性:无断路,2个已加载电路,最大2个电路,树脂颜色为黑色,耐磨损次数最大为50次,阻燃等级为94V-0,不合规的灼热丝测试,有导向配合部件,锁紧到配合部件。

### 引脚分配 - 引脚数量:2个回路

### 参数特性 - 金属材质:黄铜,锡磷青铜 - 镀层材质:配合部件镀金,终止镀锡 - 树脂材质:高温热塑性 - 排列:1行 - 方向:直角 - PC尾长度:0.130英寸(3.30毫米) - PCB厚度推荐:0.062英寸(1.60毫米) - 配合界面间距:0.100英寸(2.54毫米) - 镀层最小厚度:配合部件30微英寸(0.75微米),终止部件75微英寸(1.875微米) - 极化到配合部件:是

### 功能详解 - 防护:全护罩 - 堆叠:不支持 - 温度范围:-40°C至+105°C

### 应用信息 - 配合部件:与70066n、70066g、70430g、70400g外壳配合 - 电气特性:最大电流每接触3A,最大电压250V

### 封装信息 - 封装类型:管装 - 引脚间距:2.54毫米
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