70555-0089

70555-0089

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    70555-0089 - 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Pr...

  • 详情介绍
  • 数据手册
  • 价格&库存
70555-0089 数据手册
This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0705550089 Active cgrid__sl_products 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg, 20 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Product Specification PS-70400 (PDF) Product Specification PS-70541 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70555 Wire-to-Board cgrid__sl_products SL™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Guide to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Shrouded Stackable Temperature Range - Operating No 20 20 Black 50 94V-0 No Yes Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 1 Right Angle 0.130 In 3.30 mm Yes Yes 0.062 In 1.60 mm Tube 0.100 In 2.54 mm 30 0.75 75 1.875 Yes Fully No -40°C to +105°C Search Parts in this Series 70555Series Mates With 70066n , 70066g , 70430g , 70400g Housing Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 3A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 1 Wave Capable (TH only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0015 PS-70400, PS-70541 SDA-70555-**** This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
70555-0089
1. 物料型号: - 型号:0705550089 - 状态:Active(活跃)

2. 器件简介: - 产品系列:70555 - 应用:Wire-to-Board(线对板) - 产品名称:SLTM - 物理特性:单排,直角,0.120英寸口袋,带压配合塑料钉,20电路,0.76um(30英寸)金(Au)选择性电镀(Sn)PC尾电镀。

3. 引脚分配: - 电路(已加载):20 - 电路(最大):20

4. 参数特性: - 颜色 - 树脂耐用性(最大插拔次数):黑色,50次 - 阻燃性:94V-0 - 耐热丝合规性:否 - 导向配合件:是 - 锁到配合件:是 - 材料 - 金属:黄铜,锡磷青铜 - 材料 - 电镀配合:金 - 材料 - 电镀终止:锡 - 材料 - 树脂:高温热塑性塑料 - 行数:1 - 取向:直角 - PCB尾长(英寸):0.130英寸 - PCB尾长(毫米):3.30毫米 - PCB定位器:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.062英寸 - 推荐PCB厚度(毫米):1.60毫米 - 包装类型:管装 - 配合接口间距(英寸):0.100英寸 - 配合接口间距(毫米):2.54毫米 - 电镀最小:配合(微英寸):30 - 电镀最小:配合(微米):0.75 - 电镀最小:终止(微英寸):75 - 电镀最小:终止(微米):1.875 - 极化到配合件:是 - 护套:完全 - 可堆叠:否 - 工作温度范围:-40°C至+105°C

5. 功能详解: - 该产品为2.54mm(0.100英寸)间距SLTM头,单排,直角,0.120英寸口袋,带压配合塑料钉,20电路,0.76um(30英寸)金(Au)选择性电镀(Sn)PC尾电镀。

6. 应用信息: - 适用于线对板连接。

7. 封装信息: - 封装类型:管装 - 配合接口间距:2.54mm(0.100英寸)
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