70567-0131

厂商：
MOLEX8
封装：
描述：
70567-0131 - 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShroud...

数据手册：

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70567-0131 数据手册

This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0705670131 Active cgrid__sl_products 2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating Documents: 3D Model Drawing (PDF) Product Specification PS-70567 (PDF) RoHS Certificate of Compliance (PDF) EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70567 Wire-to-Board cgrid__sl_products C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Circuits Detail Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part No 62 62 62 Black 50 No 94V-0 No No None Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical 0.200 In 5.08 mm No Yes 0.093 In 2.36 mm Tube 0.100 In 2.54 mm 0.100 In 2.54 mm 15 0.375 75 1.875 Yes Search Parts in this Series 70567Series Mates With 70450 Crimp Housing Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Closed Ends No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2.5A 250V DC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 1 245 Material Info Old Part Number A-70567-0131 Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0018 PS-70567 SDA-70567-**** This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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70567-0131

1. 物料型号： - 型号：0705670131 - 状态：Active（活跃）

2. 器件简介： - 产品系列：70567 - 应用：Wire-to-Board（线对板） - 产品名称：C-Grid® - 概述：2.54mm (.100") 间距 C-Grid® 插座，通孔无定位销，双排，垂直封闭，高温，62路，锡（Sn）镀层

3. 引脚分配： - 引脚数量（已加载）：62 - 最大引脚数量：62 - 引脚细节：62

4. 参数特性： - 颜色 - 树脂：黑色 - 耐用性（最大插拔次数）：50 - 阻燃等级：94V-0 - 金属镀层材料：金 - 镀层终止：锡 - 树脂材料：高温热塑性塑料 - 行数：2 - 方向：垂直 - PCB尾长（英寸）：0.200 In - PCB尾长（毫米）：5.08 mm - PCB厚度推荐（英寸）：0.093 In - PCB厚度推荐（毫米）：2.36 mm - 间距 - 接口（英寸）：0.100 In - 间距 - 接口（毫米）：2.54 mm - 镀层最小值：接口15uin（0.375um），终止75uin（1.875um）

5. 功能详解： - 极化到配对部件：是 - 屏蔽：闭端 - 堆叠：否 - 表面安装兼容（SMC）：是 - 操作温度范围：-55°C至+105°C - 电气参数：最大电流每接触2.5A，最大电压250V DC

6. 应用信息： - 与70450压接外壳配合使用

7. 封装信息： - 包装类型：管装 - 引脚间距：2.54mm - 封装风格：通孔

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