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71661-2513

71661-2513

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    71661-2513 - 1.27mm (.050") Pitch EBBI™ 50D Plug, Right Angle, Blind-Mate, 130 Circuits, 2.79mm(.110...

  • 详情介绍
  • 数据手册
  • 价格&库存
71661-2513 数据手册
This document was generated on 05/31/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0716612513 Active ebbi_50d 1.27mm (.050") Pitch EBBI™ 50D Plug, Right Angle, Blind-Mate, 130 Circuits, 2.79mm (.110") PC Tail Length Documents: 3D Model Drawing (PDF) Product Specification PS-71660 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Overview Product Name PCB Headers 71661 Board-to-Board, Wire-to-Board ebbi_50d EBBI™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB No 130 130 Black 2,000 No 94V-0 No Yes None None Brass Gold Tin High Temperature Thermoplastic 2 Right Angle 0.110 In 2.79 mm Yes Yes 0.062 In 1.60 mm Tray 0.050 In 1.27 mm 0.050 In 1.27 mm 30 0.76 50 1.30 Yes Yes Search Parts in this Series 71661Series Mates With EBBI™ 50D Receptacle 71660 , 87537 Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Fully No No -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 1A 30V Solder Process Data Lead-free Process Capability Process Temperature max. C SMC & Wave Capable (TH only) 235 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-084* PS-71660 SDA-71661-25** This document was generated on 05/31/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
71661-2513
### 物料型号 - 型号:0716612513 - 状态:Active(活跃)

### 器件简介 - 描述:1.27mm (.050") 间距 EBBITM 50D 插头,直角,盲配,1 (.110") PC尾长 - 产品家族:PCB Headers - 系列:71661 - 应用:板对板、线对板

### 引脚分配 - 电路(已加载):130 - 电路(最大):130 - 行数:2

### 参数特性 - 颜色 - 树脂:黑色 - 耐用性(最大插配次数):2,000 - 阻燃性:94V-0 - PC尾长(英寸):0.110 In - PC尾长(毫米):2.79 mm - PCB厚度推荐(英寸):0.062 In - PCB厚度推荐(毫米):1.60 mm - 插配界面间距(英寸):0.050 In - 插配界面间距(毫米):1.27 mm - 终止接口间距(英寸):0.050 In - 终止接口间距(毫米):1.27 mm - 镀层最小厚度 - 插配(微英寸):30 - 镀层最小厚度 - 插配(微米):0.76 - 镀层最小厚度 - 终止(微英寸):50 - 镀层最小厚度 - 终止(微米):1.30

### 功能详解 - 是否易断:否 - 是否首配/末断:否 - 是否符合灼热丝测试:否 - 是否引导配合件:是 - 是否键控配合件:无 - 是否锁控配合件:无 - 是否极化配合件:是 - 是否极化至PCB:是

### 应用信息 - 工作温度范围:-40°C至+105°C - 最大电流每接触:1A - 最大电压:适用于无铅焊接过程

### 封装信息 - 封装类型:Tray(托盘) - 金属材质:黄铜 - 镀层材质 - 插配:金 - 镀层材质 - 终止:锡 - 树脂材质:高温热塑性塑料
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