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73642-2200

73642-2200

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73642-2200 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit,Open End...

  • 详情介绍
  • 数据手册
  • 价格&库存
73642-2200 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736422200 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit, Open End, 72 Circuits Documents: 3D Model Drawing (PDF) Test Summary (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73642 Backplane Standard Press-Fit PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) 72 72 Black, Natural 250 No 94V-0 No None Phosphor Bronze Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.062 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 Search Parts in this Series 73642Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.375 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Product Specification PS-73670-9999 Sales Drawing SDA-73642-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73642-2200
1. 物料型号: - 型号:0736422200 - 状态:Active(活跃) - 中国RoHS:Active(活跃)

2. 器件简介: - 描述:Active hdm 2.00mm (.079") Pitch HDM@ Board-to-Board Backplane Header, V Open End, 72 Circuits(活动HDM 2.00mm (.079") 间距HDM@板对板背板头,V型开口端,72电路) - 产品家族:Backplane Connectors(背板连接器) - 系列:73642 - 应用:Backplane(背板) - 组件类型:PCB Header(PCB头)

3. 引脚分配: - 电路(已加载):72 - 电路(最大):72 - 列数:12 - 行数:6 - 开放引脚场:是

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐用性(最大配对周期):250 - 阻燃性:94V-0 - 金属材质:磷青铜 - 配对金属材质 - 镀层:金 - 终止金属材质 - 镀层:锡 - 树脂材质:高温热塑性塑料

5. 功能详解: - 该产品为HDM(高密度机械)板对板背板连接器,具有72个电路,垂直方向,最大耐用性为250次配对周期。

6. 应用信息: - 应用:背板 - 注释:标准Press-Fit(压接)

7. 封装信息: - 包装类型:管装 - 配对接口间距 - 配对界面(英寸):0.079 In - 配对接口间距 - 配对界面(毫米):2.00 mm - 终止接口间距 - 终止界面(英寸):0.079 In - 终止接口间距 - 终止界面(毫米):2.00 mm - 镀层最小:配对(微英寸):30 - 镀层最小:配对(微米):0.75 - 镀层最小:终止(微英寸):15
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