73644-0016

73644-0016

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73644-0016 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Gui...

  • 详情介绍
  • 数据手册
  • 价格&库存
73644-0016 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736440016 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits Documents: 3D Model Test Summary (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 72 72 Black, Natural 250 No 94V-0 Yes None Phosphor Bronze, Stainless Steel Gold Gold High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 2 0.05 Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73644-0016
1. 物料型号: - 型号:0736440016 - 状态:Active(活跃) - 符合欧盟RoHS、中国RoHS、ELV和RoHS标准,REACH SVHC不含,无卤素,未审核。

2. 器件简介: - 描述:2.00mm (.079") 间距 HDM® 板对板背板连接器头,垂直,SMC,Press-Fit,导向销位置B,极化键位置N/A,72路。 - 产品家族:背板连接器 - 系列:73644 - 应用:背板 - 组件类型:PCB连接器头

3. 引脚分配: - 列数:12 - 行数:6 - 开放引脚对数:无 - 电路(已加载):72 - 电路(最大):72

4. 参数特性: - 颜色:树脂黑色,自然色 - 耐久性(最大插拔次数):250 - 阻燃性:94V-0 - 镀层:接触面最小30µin金,接触面最小0.75µm金,尾部最小2µin镀层,尾部最小0.05µm镀层

5. 功能详解: - 产品名称:HDM® - 物理特性:垂直方向,PCB定位器无,PCB保持有,推荐PCB厚度为0.098英寸(2.50mm) - 接口:配合界面间距0.079英寸(2.00mm),接触界面间距0.079英寸(2.00mm)

6. 应用信息: - 与73632 HDM PLUS®板对板女儿卡插座和73780 HDM®板对板女儿卡插座配合使用。

7. 封装信息: - 包装类型:管装 - 引脚长度:PC尾长0.138英寸(3.50mm)
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