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73644-0218

73644-0218

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73644-0218 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, G...

  • 详情介绍
  • 数据手册
  • 价格&库存
73644-0218 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736440218 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS Compliance Status Not Reviewed REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 72 72 Black, Natural 250 No 94V-0 No None Phosphor Bronze, Stainless Steel Gold Gold High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 2 0.05 No Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73644-0218
1. 物料型号: - 型号:0736440218

2. 器件简介: - 描述:2.00mm (.079") 间距 HDM@ 板对板背板连接器,垂直,SMC,P,72路 - 产品家族:背板连接器 - 系列:73644 - 应用:背板 - 组件类型:PCB连接器 - 概述:hdm

3. 引脚分配: - 电路(已加载):72 - 电路(最大):72 - 列数:12 - 行数:6 - 开放引脚场:无对

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐用性(最大插拔循环):250 - 阻燃性:94V-0 - 金属材质:钹青铜,不锈钢 - 镀层 - 接触:金 - 镀层 - 终止:金 - 推荐PCB厚度:2.50mm - 接口 - 间距:2.00mm

5. 功能详解: - 该连接器支持高达1.0 Gbps的数据传输速率,适用于75欧姆的信号传输,最大电压250V AC。 - 与73632 HDM PLUS®板对板子卡插座和73780 HDM®板对板子卡插座兼容。

6. 应用信息: - 适用于背板应用,标准压接式。

7. 封装信息: - 封装类型:管装 - 尾长(PCB):3.50mm - 垂直PC尾长:0.138英寸 - PCB厚度推荐:0.098英寸
73644-0218 价格&库存

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