73644-1012

73644-1012

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73644-1012 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Gui...

  • 详情介绍
  • 数据手册
  • 价格&库存
73644-1012 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736441012 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 144 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 144 144 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Gold High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 2 0.05 No Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool HDM® Backplane 0622005703 Insertion Head for 144 Positions Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole - Compliant Pin Extraction Tool 0621001000 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73644-1012
1. 物料型号: - 型号:0736441012 - 状态:Active(活跃)

2. 器件简介: - 描述:2.00mm (.079") 间距 HDM® 板对板背板连接器头,垂直安装,表面贴装兼容(SMC),PressFit,导向销位置B,极化键位G,共144个回路。

3. 引脚分配: - 回路数(已加载):144 - 最大回路数:144 - 列数:24 - 行数:6 - 开放引脚场:是

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐用性(最大插拔次数):250次 - 阻燃等级:94V-0 - 金属材质:磷青铜,不锈钢 - 镀层 - 接触:金 - 镀层 - 终止:金 - 树脂材质:高温热塑性塑料 - 推荐PCB厚度:2.50mm - 插接界面间距:2.00mm - 接触界面间距:2.00mm - 镀层最小厚度 - 接触:0.75um(30uin) - 镀层最小厚度 - 终止:0.05um(2uin)

5. 功能详解: - 该连接器支持高达1A电流,1.0 Gbps数据速率,75个无屏蔽电压最大250V AC。

6. 应用信息: - 产品家族:背板连接器 - 系列:73644 - 应用:背板 - 注释:标准Press-Fit

7. 封装信息: - 封装类型:管装 - 尾长:PC尾长3.50mm(0.138英寸) - PCB定位:无 - PCB保持:是
73644-1012 价格&库存

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