73644-2116

厂商：
MOLEX8
封装：
描述：
73644-2116 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Gu...

数据手册：

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数据手册
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73644-2116 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736442116 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit, Tin/Lead (SnPb) PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 72 72 Black, Natural 250 No 94V-0 Yes None Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 No Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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73644-2116

1. 物料型号： - 型号：0736442116 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") 间距 HDM® 板对板背板连接器头，垂直安装，表面贴装（SMC），PressFit，导向柱位置B，极化键位置N/A，72路电路。 - 环保合规：符合欧盟RoHS、中国RoHS（豁免），REACH SVHC不含，无卤素状态未审核。

3. 引脚分配： - 电路（已加载）：72 - 电路（最大）：72 - 列数：12 - 对数：开路销场 - 行数：6

4. 参数特性： - 颜色 - 树脂：黑色，自然色 - 耐用性（最大插拔次数）：250次 - 阻燃性：94V-0 - 金属材质：磷青铜，不锈钢 - 镀层 - 接触：金 - 镀层 - 终止：锡 - 树脂材质：高温热塑性塑料 - PCB厚度推荐：2.50mm

5. 功能详解： - 产品家族：背板连接器 - 系列：73644 - 应用：背板 - 组件类型：PCB连接器 - 物理接口：垂直 - 尾长PC：3.50mm - PCB保持：是 - 镀层最小值：接触部位金30微英寸/0.75微米，终止部位锡15微英寸/0.375微米

6. 应用信息： - 与73632 HDM PLUS® 板对板子卡插座兼容，73780 HDM® 板对板子卡插座。

7. 封装信息： - 包装类型：管装 - 接口 - 配合界面（间距）：2.00mm - 接口 - 终止界面（间距）：2.00mm

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