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73644-2201

73644-2201

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73644-2201 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Gui...

  • 详情介绍
  • 数据手册
  • 价格&库存
73644-2201 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736442201 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 72 Circuits Documents: 3D Model Test Summary (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit, Tin/Lead (SnPb) PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 72 72 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73644-2201
1. 物料型号: - 型号:0736442201 - 状态:Active(活跃) - 环保合规性:符合EU RoHS、中国RoHS,无SVHC(高度关注物质),无卤素,符合REACH法规。

2. 器件简介: - 描述:2.00mm(.079")间距HDM@板对板背板连接器,垂直安装,S适配,导向柱位置A,极化键位置A,72路电路。 - 产品系列:73644,属于背板连接器系列。 - 应用:标准压接式,锡/铅(SnPb)。

3. 引脚分配: - 引脚数量:72路电路(已加载),最大72路。 - 列数:12 - 行数:6 - 开放引脚场:无

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐久性(最大插拔次数):250次 - 首次配对/最后断开:否 - 阻燃等级:94V-0 - 金属材质:磷青铜,不锈钢 - 镀层 - 配对:金 - 镀层 - 终止:锡 - 树脂材质:高温热塑性塑料 - PCB厚度推荐:0.098英寸(2.50毫米) - 间距 - 配对接口(2.00毫米) - 镀层最小厚度 - 配对(0.75微米/30微英寸),镀层最小厚度 - 终止(0.375微米/15微英寸)

5. 功能详解: - 配合型号:与73632 HDM PLUS®板对板子卡插座和73780 HDM®板对板子卡插座配合使用。 - 温度范围:-55°C至+105°C - 电气特性:最大电流每接触点1A,数据速率1.0 Gbps,每25mm 75个真实信号,250V AC屏蔽电压最大值。

6. 应用信息: - 极化至PCB - 堆叠 - 表面安装兼容(SMC)

7. 封装信息: - 封装类型:管装 - 尾长PCB(英寸):0.138英寸(3.50毫米)
73644-2201 价格&库存

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