73644-2208

厂商：
MOLEX8
封装：
描述：
73644-2208 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header - Molex Electronics Ltd.

数据手册：

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数据手册
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73644-2208 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736442208 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position E, 72 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS Not RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed China RoHS Agency Certification CSA UL General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73644 Backplane Standard Press-Fit, Tin/Lead (SnPb) PCB Header hdm HDM® N/A Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 72 72 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 No Search Parts in this Series 73644Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Sales Drawing SDA-73644-**** HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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73644-2208

1. 物料型号： - 型号：0736442208 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") 间距 HDM® 板对板背板连接器，垂直，SMC（表面贴装兼容），PressFit（压接），导针位置B，极化键位置E，72路 - 产品家族：Backplane Connectors（背板连接器） - 系列：73644 - 应用：Backplane（背板） - 组件类型：PCB Header（PCB插座）

3. 引脚分配： - 电路（已加载）：72 - 电路（最大）：72 - 列数：12 - 对数：Open Pin Field（开放引脚场） - 行数：6

4. 参数特性： - 颜色 - 树脂：黑色，自然色 - 耐用性（最大插拔次数）：250 - 阻燃性：94V-0 - 金属材质：磷青铜，不锈钢 - 镀层 - 配合：金 - 镀层 - 终止：锡 - 树脂材质：高温热塑性塑料 - PCB厚度推荐（英寸）：0.098 - PCB厚度推荐（毫米）：2.50

5. 功能详解： - 配合接口（英寸）：0.079 - 配合接口（毫米）：2.00 - 终止接口（英寸）：0.079 - 终止接口（毫米）：2.00 - 镀层最小 - 配合（微英寸）：30 - 镀层最小 - 配合（微米）：0.75 - 镀层最小 - 终止（微英寸）：15 - 镀层最小 - 终止（微米）：0.375

6. 应用信息： - 与73632 HDM PLUS®板对板子卡插座兼容，73780 HDM®板对板子卡插座

7. 封装信息： - 包装类型：Tube（管装） - 尾长（英寸）：0.138 - 尾长（毫米）：3.50

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