73656-2000

73656-2000

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73656-2000 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,Power Re...

  • 详情介绍
  • 数据手册
  • 价格&库存
73656-2000 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736562000 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3 Circuits, Gold (Au) 0.76µm (30µ") Documents: Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73656 Backplane Backplane Power Module Power Header hdm HDM® N/A image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 3 3 Black 250 No No None Beryllium Copper Gold Gold High Temperature Thermoplastic 1 Open Pin Field 3 Vertical 0.138 In 3.50 mm No None 0.138 In 3.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 2 0.05 No No Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 73656Series Mates With 73651 HDM® Board-to-Board Daughterboard Power Module Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A 1.0 Gbps 75 No 500V AC Material Info Reference - Drawing Numbers Application Specification AS-73656-1998 Packaging Specification PK-70873-0819 Product Specification PS-73670-9999 Sales Drawing SDA-73656-*00* HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73656-2000
1. 物料型号: - 型号:0736562000 - 系列:73656

2. 器件简介: - 产品家族:Backplane Connectors - 应用:Backplane - 组件类型:Power Header - 概述:Active HDM 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3 Circuits, Gold (Au) 0.76µm (30µ")。

3. 引脚分配: - 电路(已加载):3 - 行数:3 - 列数:1(Open Pin Field)

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250 - 金属材料:铍铜 - 镀层 - 插接:金 - 镀层 - 终止:金 - 树脂材料:高温热塑性塑料 - 板厚推荐:0.138英寸(3.50毫米) - 插接界面间距:0.079英寸(2.00毫米) - 镀层最小值:插接30微英寸(0.75微米),终止2微英寸(0.05微米) - 操作温度范围:-55°C至+105°C

5. 功能详解: - 该产品为HDM® Board-to-Board Backplane Power Module,垂直方向,表面贴装兼容(SMC),不极化于PCB,不可堆叠。

6. 应用信息: - 与73651 HDM® Board-to-Board Daughterboard Power Module配对使用。

7. 封装信息: - 包装类型:管装 - 尾长PCB:0.138英寸(3.50毫米) - 安装方式:Press Fit(Press Fit孔径规格仅适用于锡铅镀孔,其他镀层类型请参阅Molex应用指南AS-73670-9996)
73656-2000 价格&库存

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